Investigation of rare earth-doped BiAg high-temperature solders View Full Text


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Article Info

DATE

2009-11-13

AUTHORS

Yaowu Shi, Weiping Fang, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

ABSTRACT

In the present work, the microstructure and properties of the rare earth Ce-doped BiAg solders with various Ag content are investigated. The results indicate that the maximum of the shear strength appears in the BiAg solder joints containing 5 and 7.5 wt.% Ag. At the same time, a similar trend appears in the hardness test of the BiAg bulk solders. Moreover, the results show that the microstructure and properties of the solders can be modified due to the unique properties of rare earth element. Small amounts of rare earth addition may enhance the wettability of SiAg solder on Cu substrate, and result in the increase of the shear strength of the solder joints. However, the rare earth addition may not give obvious influence on the melting temperature and the electrical conductivity. Thus, it is expected that the BiAg solder containing small amounts of rare earth element may possess a better potential as a replacement for high-Pb solders. More... »

PAGES

875-881

References to SciGraph publications

  • 1999-11. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06. Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-05. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-11. Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-03-24. Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2003-04. Properties of lead-free solder SnAgCu containing minute amounts of rare earth in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-10. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04-18. Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-09-12. Rare-earth additions to lead-free electronic solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2002-04. Zn-Al based alloys as Pb-free solders for die attach in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-11-20. Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-09-17. Study on the Microstructure and Wettability of an Al-Cu-Si Braze Containing Small Amounts of Rare Earth Erbium in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
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    http://scigraph.springernature.com/pub.10.1007/s10854-009-0010-5

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    http://dx.doi.org/10.1007/s10854-009-0010-5

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