Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2007-06

AUTHORS

X. P. Zhang, C. B. Yu, S. Shrestha, L. Dorn

ABSTRACT

Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property. More... »

PAGES

665-670

References to SciGraph publications

  • 1994-07. On the Sn-Bi-Ag ternary phase diagram in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-08. Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin–lead based solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/s10854-006-9078-3

    DOI

    http://dx.doi.org/10.1007/s10854-006-9078-3

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1044481118


    Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
    Incoming Citations Browse incoming citations for this publication using opencitations.net

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "about": [
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Materials Engineering", 
            "type": "DefinedTerm"
          }, 
          {
            "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
            "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
            "name": "Engineering", 
            "type": "DefinedTerm"
          }
        ], 
        "author": [
          {
            "affiliation": {
              "alternateName": "South China University of Technology", 
              "id": "https://www.grid.ac/institutes/grid.79703.3a", 
              "name": [
                "Institute of Material Science and Technology, School of Mechanical Engineering, South China University of Technology, Wu-shan, Tian-he District, 510640, Guangzhou, Guang-Dong, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Zhang", 
            "givenName": "X. P.", 
            "id": "sg:person.01325634453.52", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01325634453.52"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "South China University of Technology", 
              "id": "https://www.grid.ac/institutes/grid.79703.3a", 
              "name": [
                "Institute of Material Science and Technology, School of Mechanical Engineering, South China University of Technology, Wu-shan, Tian-he District, 510640, Guangzhou, Guang-Dong, China"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Yu", 
            "givenName": "C. B.", 
            "id": "sg:person.016236617264.42", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016236617264.42"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Technical University of Berlin", 
              "id": "https://www.grid.ac/institutes/grid.6734.6", 
              "name": [
                "Department of Mechanical Engineering, Technical University Berlin, 60123, Berlin, Germany"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Shrestha", 
            "givenName": "S.", 
            "id": "sg:person.012001644677.84", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012001644677.84"
            ], 
            "type": "Person"
          }, 
          {
            "affiliation": {
              "alternateName": "Technical University of Berlin", 
              "id": "https://www.grid.ac/institutes/grid.6734.6", 
              "name": [
                "Department of Mechanical Engineering, Technical University Berlin, 60123, Berlin, Germany"
              ], 
              "type": "Organization"
            }, 
            "familyName": "Dorn", 
            "givenName": "L.", 
            "id": "sg:person.014166677655.71", 
            "sameAs": [
              "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014166677655.71"
            ], 
            "type": "Person"
          }
        ], 
        "citation": [
          {
            "id": "sg:pub.10.1007/bf02653345", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1006198868", 
              "https://doi.org/10.1007/bf02653345"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1007/bf02653345", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1006198868", 
              "https://doi.org/10.1007/bf02653345"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/j.stam.2003.10.024", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1012785871"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1016/s1359-0286(00)00036-x", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1017600784"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "sg:pub.10.1023/b:jmse.0000032585.03009.1b", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1036230053", 
              "https://doi.org/10.1023/b:jmse.0000032585.03009.1b"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1063/1.1517165", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1057715338"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1108/09540919710800656", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061013601"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/tadvp.2004.841660", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1061480648"
            ], 
            "type": "CreativeWork"
          }, 
          {
            "id": "https://doi.org/10.1109/isaom.2001.916562", 
            "sameAs": [
              "https://app.dimensions.ai/details/publication/pub.1093978554"
            ], 
            "type": "CreativeWork"
          }
        ], 
        "datePublished": "2007-06", 
        "datePublishedReg": "2007-06-01", 
        "description": "Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn\u2013Ag\u2013Cu\u2013Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71\u2013 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn\u2013Ag\u2013Cu\u2013Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn\u2013Ag\u2013Cu\u2013Bi solder exhibits a superb fatigue property.", 
        "genre": "research_article", 
        "id": "sg:pub.10.1007/s10854-006-9078-3", 
        "inLanguage": [
          "en"
        ], 
        "isAccessibleForFree": false, 
        "isFundedItemOf": [
          {
            "id": "sg:grant.5074095", 
            "type": "MonetaryGrant"
          }, 
          {
            "id": "sg:grant.4993203", 
            "type": "MonetaryGrant"
          }
        ], 
        "isPartOf": [
          {
            "id": "sg:journal.1136825", 
            "issn": [
              "0957-4522", 
              "1573-482X"
            ], 
            "name": "Journal of Materials Science: Materials in Electronics", 
            "type": "Periodical"
          }, 
          {
            "issueNumber": "6", 
            "type": "PublicationIssue"
          }, 
          {
            "type": "PublicationVolume", 
            "volumeNumber": "18"
          }
        ], 
        "name": "Creep and fatigue behaviors of the lead-free Sn\u2013Ag\u2013Cu\u2013Bi and Sn60Pb40 solder interconnections at elevated temperatures", 
        "pagination": "665-670", 
        "productId": [
          {
            "name": "doi", 
            "type": "PropertyValue", 
            "value": [
              "10.1007/s10854-006-9078-3"
            ]
          }, 
          {
            "name": "readcube_id", 
            "type": "PropertyValue", 
            "value": [
              "d3e155074a065e0c6bd6586092272226bbaa155a4ef41dffab1e11fd32104f37"
            ]
          }, 
          {
            "name": "dimensions_id", 
            "type": "PropertyValue", 
            "value": [
              "pub.1044481118"
            ]
          }
        ], 
        "sameAs": [
          "https://doi.org/10.1007/s10854-006-9078-3", 
          "https://app.dimensions.ai/details/publication/pub.1044481118"
        ], 
        "sdDataset": "articles", 
        "sdDatePublished": "2019-04-15T09:22", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000376_0000000376/records_56185_00000002.jsonl", 
        "type": "ScholarlyArticle", 
        "url": "http://link.springer.com/10.1007%2Fs10854-006-9078-3"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s10854-006-9078-3'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s10854-006-9078-3'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s10854-006-9078-3'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s10854-006-9078-3'


     

    This table displays all metadata directly associated to this object as RDF triples.

    115 TRIPLES      21 PREDICATES      35 URIs      19 LITERALS      7 BLANK NODES

    Subject Predicate Object
    1 sg:pub.10.1007/s10854-006-9078-3 schema:about anzsrc-for:09
    2 anzsrc-for:0912
    3 schema:author N03fd4f32d4364edda2fd31eb02a7ba91
    4 schema:citation sg:pub.10.1007/bf02653345
    5 sg:pub.10.1023/b:jmse.0000032585.03009.1b
    6 https://doi.org/10.1016/j.stam.2003.10.024
    7 https://doi.org/10.1016/s1359-0286(00)00036-x
    8 https://doi.org/10.1063/1.1517165
    9 https://doi.org/10.1108/09540919710800656
    10 https://doi.org/10.1109/isaom.2001.916562
    11 https://doi.org/10.1109/tadvp.2004.841660
    12 schema:datePublished 2007-06
    13 schema:datePublishedReg 2007-06-01
    14 schema:description Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property.
    15 schema:genre research_article
    16 schema:inLanguage en
    17 schema:isAccessibleForFree false
    18 schema:isPartOf Nc431eefc2a784b1c8cfa350209d48036
    19 Ne0feba28f6da4be4aa8ac86e5063fd94
    20 sg:journal.1136825
    21 schema:name Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures
    22 schema:pagination 665-670
    23 schema:productId N037532e0b33e48009c2ccc4b79bb49e4
    24 N141caa85f706408ab9ebbc6d97b8ea20
    25 Nbee12fe7ce1e4de8bdd363c14c38e118
    26 schema:sameAs https://app.dimensions.ai/details/publication/pub.1044481118
    27 https://doi.org/10.1007/s10854-006-9078-3
    28 schema:sdDatePublished 2019-04-15T09:22
    29 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    30 schema:sdPublisher Na5c1643e0d314bcf871361c9cf6c6a37
    31 schema:url http://link.springer.com/10.1007%2Fs10854-006-9078-3
    32 sgo:license sg:explorer/license/
    33 sgo:sdDataset articles
    34 rdf:type schema:ScholarlyArticle
    35 N037532e0b33e48009c2ccc4b79bb49e4 schema:name readcube_id
    36 schema:value d3e155074a065e0c6bd6586092272226bbaa155a4ef41dffab1e11fd32104f37
    37 rdf:type schema:PropertyValue
    38 N03fd4f32d4364edda2fd31eb02a7ba91 rdf:first sg:person.01325634453.52
    39 rdf:rest N4554859061c64aa6934337a3921cac0b
    40 N141caa85f706408ab9ebbc6d97b8ea20 schema:name dimensions_id
    41 schema:value pub.1044481118
    42 rdf:type schema:PropertyValue
    43 N4554859061c64aa6934337a3921cac0b rdf:first sg:person.016236617264.42
    44 rdf:rest N6046b7dddc1043b7be8ad52776b39740
    45 N6046b7dddc1043b7be8ad52776b39740 rdf:first sg:person.012001644677.84
    46 rdf:rest N8a79cbcd964c42caa19e8e43d825c1c6
    47 N8a79cbcd964c42caa19e8e43d825c1c6 rdf:first sg:person.014166677655.71
    48 rdf:rest rdf:nil
    49 Na5c1643e0d314bcf871361c9cf6c6a37 schema:name Springer Nature - SN SciGraph project
    50 rdf:type schema:Organization
    51 Nbee12fe7ce1e4de8bdd363c14c38e118 schema:name doi
    52 schema:value 10.1007/s10854-006-9078-3
    53 rdf:type schema:PropertyValue
    54 Nc431eefc2a784b1c8cfa350209d48036 schema:volumeNumber 18
    55 rdf:type schema:PublicationVolume
    56 Ne0feba28f6da4be4aa8ac86e5063fd94 schema:issueNumber 6
    57 rdf:type schema:PublicationIssue
    58 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
    59 schema:name Engineering
    60 rdf:type schema:DefinedTerm
    61 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
    62 schema:name Materials Engineering
    63 rdf:type schema:DefinedTerm
    64 sg:grant.4993203 http://pending.schema.org/fundedItem sg:pub.10.1007/s10854-006-9078-3
    65 rdf:type schema:MonetaryGrant
    66 sg:grant.5074095 http://pending.schema.org/fundedItem sg:pub.10.1007/s10854-006-9078-3
    67 rdf:type schema:MonetaryGrant
    68 sg:journal.1136825 schema:issn 0957-4522
    69 1573-482X
    70 schema:name Journal of Materials Science: Materials in Electronics
    71 rdf:type schema:Periodical
    72 sg:person.012001644677.84 schema:affiliation https://www.grid.ac/institutes/grid.6734.6
    73 schema:familyName Shrestha
    74 schema:givenName S.
    75 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012001644677.84
    76 rdf:type schema:Person
    77 sg:person.01325634453.52 schema:affiliation https://www.grid.ac/institutes/grid.79703.3a
    78 schema:familyName Zhang
    79 schema:givenName X. P.
    80 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01325634453.52
    81 rdf:type schema:Person
    82 sg:person.014166677655.71 schema:affiliation https://www.grid.ac/institutes/grid.6734.6
    83 schema:familyName Dorn
    84 schema:givenName L.
    85 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014166677655.71
    86 rdf:type schema:Person
    87 sg:person.016236617264.42 schema:affiliation https://www.grid.ac/institutes/grid.79703.3a
    88 schema:familyName Yu
    89 schema:givenName C. B.
    90 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.016236617264.42
    91 rdf:type schema:Person
    92 sg:pub.10.1007/bf02653345 schema:sameAs https://app.dimensions.ai/details/publication/pub.1006198868
    93 https://doi.org/10.1007/bf02653345
    94 rdf:type schema:CreativeWork
    95 sg:pub.10.1023/b:jmse.0000032585.03009.1b schema:sameAs https://app.dimensions.ai/details/publication/pub.1036230053
    96 https://doi.org/10.1023/b:jmse.0000032585.03009.1b
    97 rdf:type schema:CreativeWork
    98 https://doi.org/10.1016/j.stam.2003.10.024 schema:sameAs https://app.dimensions.ai/details/publication/pub.1012785871
    99 rdf:type schema:CreativeWork
    100 https://doi.org/10.1016/s1359-0286(00)00036-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1017600784
    101 rdf:type schema:CreativeWork
    102 https://doi.org/10.1063/1.1517165 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057715338
    103 rdf:type schema:CreativeWork
    104 https://doi.org/10.1108/09540919710800656 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061013601
    105 rdf:type schema:CreativeWork
    106 https://doi.org/10.1109/isaom.2001.916562 schema:sameAs https://app.dimensions.ai/details/publication/pub.1093978554
    107 rdf:type schema:CreativeWork
    108 https://doi.org/10.1109/tadvp.2004.841660 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061480648
    109 rdf:type schema:CreativeWork
    110 https://www.grid.ac/institutes/grid.6734.6 schema:alternateName Technical University of Berlin
    111 schema:name Department of Mechanical Engineering, Technical University Berlin, 60123, Berlin, Germany
    112 rdf:type schema:Organization
    113 https://www.grid.ac/institutes/grid.79703.3a schema:alternateName South China University of Technology
    114 schema:name Institute of Material Science and Technology, School of Mechanical Engineering, South China University of Technology, Wu-shan, Tian-he District, 510640, Guangzhou, Guang-Dong, China
    115 rdf:type schema:Organization
     




    Preview window. Press ESC to close (or click here)


    ...