Creep of sintered porous micron-silver: nanoindentation experiment and theoretical analysis View Full Text


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Article Info

DATE

2021-09-01

AUTHORS

Gong He, Wu Hongcheng, Yao Yao

ABSTRACT

Nano/micron-silver paste has been applied in high-temperature packaging of chips as a potential lead-free solder. At specific sintering temperature, the particle size in the silver paste affects the sintering quality, which plays an important role in the mechanical properties of the sintered nano/micron-silver materials. In the current study, the macro- and micromechanical properties of the sintered specimens by three micron-silver paste with different average particle sizes were studied. It was found that the tensile and shear strength of the micron-silver joint sintering at 300 °C for 50 min decreased gradually with the increase in average particle size, while the compressive strength and fracture strain increased with the increase in average particle size. Scanning electron microscope analysis showed that smaller silver particle size leads to better sintered effect. At the microlevel, the creep properties of specimens sintered with three kinds of micron-silver paste were studied by nanoindentation experiment. Based on the entropy theory and continuous damage mechanics, a micro-creep model incorporating damage was developed. The proposed model could accurately predict the micro-creep compared with the nanoindentation experimental results. More... »

PAGES

18281-18299

References to SciGraph publications

  • 2020-04-03. Corrosion effects on sintered nano-silver joints and the secondary biological hazards in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2012-02-08. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-02-22. Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-01-12. Quantitative Analysis of Porosity and Transport Properties by FIB-SEM 3D Imaging of a Solder Based Sintered Silver for a New Microelectronic Component in JOURNAL OF ELECTRONIC MATERIALS
  • 1999-03. Indentation power-law creep of high-purity indium in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 1990-05. Mechanical properties of nanophase TiO2 as determined by nanoindentation in JOURNAL OF MATERIALS RESEARCH
  • 2004-01. Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology in JOURNAL OF MATERIALS RESEARCH
  • 2017-10-13. Elevated-temperature shear creep evolution and life prediction of sintered nano-silver lap-shear joint in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-01-17. Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-10-23. High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-08-04. Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-05-16. Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability in JOURNAL OF ELECTRONIC MATERIALS
  • 1992-06. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments in JOURNAL OF MATERIALS RESEARCH
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    URI

    http://scigraph.springernature.com/pub.10.1007/s10853-021-06426-8

    DOI

    http://dx.doi.org/10.1007/s10853-021-06426-8

    DIMENSIONS

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