Interfacial fracture toughness of sintered hybrid silver interconnects View Full Text


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Article Info

DATE

2019-12-01

AUTHORS

Shaobin Wang, Christoph Kirchlechner, Leon Keer, Gerhard Dehm, Yao Yao

ABSTRACT

The interfacial fracture toughness of sintered hybrid silver nanoparticles (AgNPs) on both Au and Cu substrates is studied as a function of sintering temperature. Interfacial microstructure and porosity evolution of Au/AgNPs and Cu/AgNPs are observed to impact the fracture toughness. An Au–Ag interfacial diffusion layer is resolved at the interface of Au/AgNPs interconnects, while an oxide layer is found at the interface of Cu/AgNPs interconnects. Both porosity and pore sizes of the sintered silver interconnects are analyzed across the micro- and macro-length scales and related to the interfacial fracture toughness. The experimental observations can be theoretically described, which permits to predict the fracture toughness of the sintered silver interconnects. More... »

PAGES

2891-2904

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10853-019-04212-1

DOI

http://dx.doi.org/10.1007/s10853-019-04212-1

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1123045408


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