An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2017-02-10

AUTHORS

Xu Long, Xu He, Yao Yao

ABSTRACT

Based on the unified creep and plasticity theory, an improved constitutive model is proposed in this study to describe the uniaxial mechanical behaviour of Sn3.0Ag0.5Cu (SAC305) solder alloy subjected to a wide range of strain rates. In the usual service condition of electronic devices, the strain rates of solder material are far less than 1.0 s−1 at which the creep deformation is dominant, especially at higher working temperatures. However, the strain rate could range from 1.0 to 300 s−1 under drop impact in electronic packaging structures, which is drawing more attention due to lack of experimental data, especially on dynamic mechanical properties of lead-free solder alloys. In extreme impact conditions, the solder material may experience even higher strain rates. As different mechanisms dominate the respective regime of strain rates, the developed constitutive model is calibrated to be applicable to most of the strain rate regimes by properly considering the coupled effect of creep and plasticity. Moreover, the parameters in the proposed model are defined with clear physical meanings and reasonably determined by regression to the published experimental studies. Lastly, the developed model is compared with other constitutive models from the literature, including the power-law equation for creep deformation at low strain rates and the Johnson–Cook model for plastic deformation at high strain rates. It is concluded that the proposed model is more generalized and capable of predicting uniaxial mechanical behaviour of SAC305 solder at low, medium and high strain rates with reasonable accuracy. More... »

PAGES

6120-6137

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10853-017-0851-x

DOI

http://dx.doi.org/10.1007/s10853-017-0851-x

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1083762358


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Long", 
        "givenName": "Xu", 
        "id": "sg:person.010352721063.26", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010352721063.26"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "He", 
        "givenName": "Xu", 
        "id": "sg:person.012335270321.31", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012335270321.31"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China", 
          "id": "http://www.grid.ac/institutes/grid.440588.5", 
          "name": [
            "School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi\u2019an, People\u2019s Republic of China"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Yao", 
        "givenName": "Yao", 
        "id": "sg:person.011313423711.63", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/s10853-010-5231-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1021238173", 
          "https://doi.org/10.1007/s10853-010-5231-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-015-9230-7", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018864994", 
          "https://doi.org/10.1007/s10853-015-9230-7"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-012-7035-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1042923125", 
          "https://doi.org/10.1007/s10853-012-7035-5"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-012-7070-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1037395355", 
          "https://doi.org/10.1007/s10853-012-7070-2"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-011-5401-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1051852581", 
          "https://doi.org/10.1007/s10853-011-5401-3"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-016-0234-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1037315995", 
          "https://doi.org/10.1007/s10853-016-0234-8"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-008-0403-x", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1016898984", 
          "https://doi.org/10.1007/s11664-008-0403-x"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s11664-001-0149-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1045041242", 
          "https://doi.org/10.1007/s11664-001-0149-1"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-008-3125-9", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1010357683", 
          "https://doi.org/10.1007/s10853-008-3125-9"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/s10853-012-6807-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1016545249", 
          "https://doi.org/10.1007/s10853-012-6807-2"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2017-02-10", 
    "datePublishedReg": "2017-02-10", 
    "description": "Based on the unified creep and plasticity theory, an improved constitutive model is proposed in this study to describe the uniaxial mechanical behaviour of Sn3.0Ag0.5Cu (SAC305) solder alloy subjected to a wide range of strain rates. In the usual service condition of electronic devices, the strain rates of solder material are far less than 1.0\u00a0s\u22121 at which the creep deformation is dominant, especially at higher working temperatures. However, the strain rate could range from 1.0 to 300\u00a0s\u22121 under drop impact in electronic packaging structures, which is drawing more attention due to lack of experimental data, especially on dynamic mechanical properties of lead-free solder alloys. In extreme impact conditions, the solder material may experience even higher strain rates. As different mechanisms dominate the respective regime of strain rates, the developed constitutive model is calibrated to be applicable to most of the strain rate regimes by properly considering the coupled effect of creep and plasticity. Moreover, the parameters in the proposed model are defined with clear physical meanings and reasonably determined by regression to the published experimental studies. Lastly, the developed model is compared with other constitutive models from the literature, including the power-law equation for creep deformation at low strain rates and the Johnson\u2013Cook model for plastic deformation at high strain rates. It is concluded that the proposed model is more generalized and capable of predicting uniaxial mechanical behaviour of SAC305 solder at low, medium and high strain rates with reasonable accuracy.", 
    "genre": "article", 
    "id": "sg:pub.10.1007/s10853-017-0851-x", 
    "isAccessibleForFree": false, 
    "isFundedItemOf": [
      {
        "id": "sg:grant.8263985", 
        "type": "MonetaryGrant"
      }, 
      {
        "id": "sg:grant.8124494", 
        "type": "MonetaryGrant"
      }
    ], 
    "isPartOf": [
      {
        "id": "sg:journal.1312116", 
        "issn": [
          "0022-2461", 
          "1573-4803"
        ], 
        "name": "Journal of Materials Science", 
        "publisher": "Springer Nature", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "10", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "52"
      }
    ], 
    "keywords": [
      "high strain rates", 
      "uniaxial mechanical behavior", 
      "strain rate", 
      "constitutive model", 
      "solder materials", 
      "creep deformation", 
      "mechanical behavior", 
      "solder alloy", 
      "unified creep-plasticity model", 
      "lead-free solder alloys", 
      "Johnson-Cook model", 
      "effect of creep", 
      "low strain rates", 
      "strain rate regime", 
      "electronic packaging structures", 
      "dynamic mechanical properties", 
      "creep-plasticity model", 
      "high working temperature", 
      "extreme impact conditions", 
      "unified creep", 
      "SAC305 solder", 
      "plastic deformation", 
      "packaging structure", 
      "mechanical properties", 
      "SnAgCu solder", 
      "service conditions", 
      "drop impact", 
      "plasticity theory", 
      "working temperature", 
      "power law equation", 
      "impact conditions", 
      "clear physical meaning", 
      "electronic devices", 
      "deformation", 
      "solder", 
      "alloy", 
      "creep", 
      "experimental data", 
      "experimental study", 
      "reasonable accuracy", 
      "wide range", 
      "physical meaning", 
      "materials", 
      "devices", 
      "behavior", 
      "model", 
      "temperature", 
      "range", 
      "regime", 
      "conditions", 
      "respective regimes", 
      "properties", 
      "equations", 
      "parameters", 
      "rate", 
      "more attention", 
      "accuracy", 
      "structure", 
      "rate regime", 
      "effect", 
      "plasticity", 
      "different mechanisms", 
      "mechanism", 
      "study", 
      "theory", 
      "impact", 
      "attention", 
      "data", 
      "literature", 
      "lack", 
      "regression", 
      "meaning"
    ], 
    "name": "An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates", 
    "pagination": "6120-6137", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1083762358"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/s10853-017-0851-x"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/s10853-017-0851-x", 
      "https://app.dimensions.ai/details/publication/pub.1083762358"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2022-12-01T06:36", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-springernature-scigraph/baseset/20221201/entities/gbq_results/article/article_733.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "https://doi.org/10.1007/s10853-017-0851-x"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/s10853-017-0851-x'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/s10853-017-0851-x'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/s10853-017-0851-x'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/s10853-017-0851-x'


 

This table displays all metadata directly associated to this object as RDF triples.

187 TRIPLES      21 PREDICATES      106 URIs      88 LITERALS      6 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/s10853-017-0851-x schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author N2a7b3ad72c6e458ca145a21626c50404
4 schema:citation sg:pub.10.1007/s10853-008-3125-9
5 sg:pub.10.1007/s10853-010-5231-8
6 sg:pub.10.1007/s10853-011-5401-3
7 sg:pub.10.1007/s10853-012-6807-2
8 sg:pub.10.1007/s10853-012-7035-5
9 sg:pub.10.1007/s10853-012-7070-2
10 sg:pub.10.1007/s10853-015-9230-7
11 sg:pub.10.1007/s10853-016-0234-8
12 sg:pub.10.1007/s11664-001-0149-1
13 sg:pub.10.1007/s11664-008-0403-x
14 schema:datePublished 2017-02-10
15 schema:datePublishedReg 2017-02-10
16 schema:description Based on the unified creep and plasticity theory, an improved constitutive model is proposed in this study to describe the uniaxial mechanical behaviour of Sn3.0Ag0.5Cu (SAC305) solder alloy subjected to a wide range of strain rates. In the usual service condition of electronic devices, the strain rates of solder material are far less than 1.0 s−1 at which the creep deformation is dominant, especially at higher working temperatures. However, the strain rate could range from 1.0 to 300 s−1 under drop impact in electronic packaging structures, which is drawing more attention due to lack of experimental data, especially on dynamic mechanical properties of lead-free solder alloys. In extreme impact conditions, the solder material may experience even higher strain rates. As different mechanisms dominate the respective regime of strain rates, the developed constitutive model is calibrated to be applicable to most of the strain rate regimes by properly considering the coupled effect of creep and plasticity. Moreover, the parameters in the proposed model are defined with clear physical meanings and reasonably determined by regression to the published experimental studies. Lastly, the developed model is compared with other constitutive models from the literature, including the power-law equation for creep deformation at low strain rates and the Johnson–Cook model for plastic deformation at high strain rates. It is concluded that the proposed model is more generalized and capable of predicting uniaxial mechanical behaviour of SAC305 solder at low, medium and high strain rates with reasonable accuracy.
17 schema:genre article
18 schema:isAccessibleForFree false
19 schema:isPartOf N18510ab12b14400f84cbc7a25bfd99d6
20 Naebfec3ab3c24703ba11e867c4aa1ed7
21 sg:journal.1312116
22 schema:keywords Johnson-Cook model
23 SAC305 solder
24 SnAgCu solder
25 accuracy
26 alloy
27 attention
28 behavior
29 clear physical meaning
30 conditions
31 constitutive model
32 creep
33 creep deformation
34 creep-plasticity model
35 data
36 deformation
37 devices
38 different mechanisms
39 drop impact
40 dynamic mechanical properties
41 effect
42 effect of creep
43 electronic devices
44 electronic packaging structures
45 equations
46 experimental data
47 experimental study
48 extreme impact conditions
49 high strain rates
50 high working temperature
51 impact
52 impact conditions
53 lack
54 lead-free solder alloys
55 literature
56 low strain rates
57 materials
58 meaning
59 mechanical behavior
60 mechanical properties
61 mechanism
62 model
63 more attention
64 packaging structure
65 parameters
66 physical meaning
67 plastic deformation
68 plasticity
69 plasticity theory
70 power law equation
71 properties
72 range
73 rate
74 rate regime
75 reasonable accuracy
76 regime
77 regression
78 respective regimes
79 service conditions
80 solder
81 solder alloy
82 solder materials
83 strain rate
84 strain rate regime
85 structure
86 study
87 temperature
88 theory
89 uniaxial mechanical behavior
90 unified creep
91 unified creep-plasticity model
92 wide range
93 working temperature
94 schema:name An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates
95 schema:pagination 6120-6137
96 schema:productId N0a7397c618364537beaa1e4bf7ff19a3
97 N876ca686799742cd9116fb1b707e9ec2
98 schema:sameAs https://app.dimensions.ai/details/publication/pub.1083762358
99 https://doi.org/10.1007/s10853-017-0851-x
100 schema:sdDatePublished 2022-12-01T06:36
101 schema:sdLicense https://scigraph.springernature.com/explorer/license/
102 schema:sdPublisher Nf9bb677e57ea4609aaccafdcc1df6c22
103 schema:url https://doi.org/10.1007/s10853-017-0851-x
104 sgo:license sg:explorer/license/
105 sgo:sdDataset articles
106 rdf:type schema:ScholarlyArticle
107 N0a7397c618364537beaa1e4bf7ff19a3 schema:name doi
108 schema:value 10.1007/s10853-017-0851-x
109 rdf:type schema:PropertyValue
110 N18510ab12b14400f84cbc7a25bfd99d6 schema:issueNumber 10
111 rdf:type schema:PublicationIssue
112 N1fad1e22443b470f86c746cd23be2524 rdf:first sg:person.011313423711.63
113 rdf:rest rdf:nil
114 N2a7b3ad72c6e458ca145a21626c50404 rdf:first sg:person.010352721063.26
115 rdf:rest Nbd3ff78588b840c19f2fc9baff4fb208
116 N876ca686799742cd9116fb1b707e9ec2 schema:name dimensions_id
117 schema:value pub.1083762358
118 rdf:type schema:PropertyValue
119 Naebfec3ab3c24703ba11e867c4aa1ed7 schema:volumeNumber 52
120 rdf:type schema:PublicationVolume
121 Nbd3ff78588b840c19f2fc9baff4fb208 rdf:first sg:person.012335270321.31
122 rdf:rest N1fad1e22443b470f86c746cd23be2524
123 Nf9bb677e57ea4609aaccafdcc1df6c22 schema:name Springer Nature - SN SciGraph project
124 rdf:type schema:Organization
125 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
126 schema:name Engineering
127 rdf:type schema:DefinedTerm
128 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
129 schema:name Materials Engineering
130 rdf:type schema:DefinedTerm
131 sg:grant.8124494 http://pending.schema.org/fundedItem sg:pub.10.1007/s10853-017-0851-x
132 rdf:type schema:MonetaryGrant
133 sg:grant.8263985 http://pending.schema.org/fundedItem sg:pub.10.1007/s10853-017-0851-x
134 rdf:type schema:MonetaryGrant
135 sg:journal.1312116 schema:issn 0022-2461
136 1573-4803
137 schema:name Journal of Materials Science
138 schema:publisher Springer Nature
139 rdf:type schema:Periodical
140 sg:person.010352721063.26 schema:affiliation grid-institutes:grid.440588.5
141 schema:familyName Long
142 schema:givenName Xu
143 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.010352721063.26
144 rdf:type schema:Person
145 sg:person.011313423711.63 schema:affiliation grid-institutes:grid.440588.5
146 schema:familyName Yao
147 schema:givenName Yao
148 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011313423711.63
149 rdf:type schema:Person
150 sg:person.012335270321.31 schema:affiliation grid-institutes:grid.440588.5
151 schema:familyName He
152 schema:givenName Xu
153 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012335270321.31
154 rdf:type schema:Person
155 sg:pub.10.1007/s10853-008-3125-9 schema:sameAs https://app.dimensions.ai/details/publication/pub.1010357683
156 https://doi.org/10.1007/s10853-008-3125-9
157 rdf:type schema:CreativeWork
158 sg:pub.10.1007/s10853-010-5231-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1021238173
159 https://doi.org/10.1007/s10853-010-5231-8
160 rdf:type schema:CreativeWork
161 sg:pub.10.1007/s10853-011-5401-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1051852581
162 https://doi.org/10.1007/s10853-011-5401-3
163 rdf:type schema:CreativeWork
164 sg:pub.10.1007/s10853-012-6807-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1016545249
165 https://doi.org/10.1007/s10853-012-6807-2
166 rdf:type schema:CreativeWork
167 sg:pub.10.1007/s10853-012-7035-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1042923125
168 https://doi.org/10.1007/s10853-012-7035-5
169 rdf:type schema:CreativeWork
170 sg:pub.10.1007/s10853-012-7070-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1037395355
171 https://doi.org/10.1007/s10853-012-7070-2
172 rdf:type schema:CreativeWork
173 sg:pub.10.1007/s10853-015-9230-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018864994
174 https://doi.org/10.1007/s10853-015-9230-7
175 rdf:type schema:CreativeWork
176 sg:pub.10.1007/s10853-016-0234-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1037315995
177 https://doi.org/10.1007/s10853-016-0234-8
178 rdf:type schema:CreativeWork
179 sg:pub.10.1007/s11664-001-0149-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1045041242
180 https://doi.org/10.1007/s11664-001-0149-1
181 rdf:type schema:CreativeWork
182 sg:pub.10.1007/s11664-008-0403-x schema:sameAs https://app.dimensions.ai/details/publication/pub.1016898984
183 https://doi.org/10.1007/s11664-008-0403-x
184 rdf:type schema:CreativeWork
185 grid-institutes:grid.440588.5 schema:alternateName School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
186 schema:name School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, 710072, Xi’an, People’s Republic of China
187 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...