Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2009-12-29

AUTHORS

Yu. Plevachuk, W. Hoyer, I. Kaban, M. Köhler, R. Novakovic

ABSTRACT

The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys have been measured over a wide temperature range by the sessile-drop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of these alloys on the Cu and Ni substrates in a vacuum were also performed. More... »

PAGES

2051-2056

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10853-009-4120-5

DOI

http://dx.doi.org/10.1007/s10853-009-4120-5

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1008967032


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