Liquid–Liquid Interfacial Tension in Ternary Monotectic Alloys Al–Bi–Cu and Al–Bi–Si View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2007-04

AUTHORS

I. Kaban, W. Hoyer, M. Kehr

ABSTRACT

The liquid–liquid interfacial tension in the ternary monotectic alloys Al34.5-xBi65.5Cux and (Al0.345Bi0.655)100-xSix (mass%) has been determined as a function of its Cu (Si) content by a tensiometric technique. It is established that the interfacial tension gradually increases when either Cu or Si is added to Al–Bi alloys. The increase of \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\sigma_{\alpha \beta}$$\end{document} can be related to the increase of the miscibility gap (both width and height) when Cu (Si) is added to the Al–Bi binary. The temperature dependences of the interfacial tension in binary Al34.5Bi65.5 and ternary Al23.25Bi65.5Cu11.25 and (Al0.345Bi0.655)95Si5 monotectic alloys are well described by the power function \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\sigma_{\alpha \beta}=\sigma_{0}\cdot(1-T/T_{\rm C})^{\mu}$$\end{document} with the critical-point exponent \documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\mu=1.3$$\end{document}. More... »

PAGES

723-731

References to SciGraph publications

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s10765-007-0184-0

DOI

http://dx.doi.org/10.1007/s10765-007-0184-0

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1048107439


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