Microlens array fabrication by backside exposure using Fraunhofer diffraction View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

2008-10

AUTHORS

In-Hyouk Song, Kyung-Nam Kang, Yoonyoung Jin, Daniel S.-W. Park, Pratul K. Ajmera

ABSTRACT

In UV-lithography, a gap between photoresist and UV-mask results in diffraction. Fresnel or near-field diffraction in thick positive and negative resists for microstructures resulting from a small gap in contact or proximity printing has been previously investigated. In this work, Fraunhofer or far-field diffraction is utilized to form microlens arrays. Backside-exposure of SU-8 resist through Pyrex 7740 transparent glass substrate is conducted. The exposure intensity profile on the interface between Pyrex 7740 glass wafer and negative SU-8 resist is modeled taking into account Fraunhofer diffraction for a circular aperture opening. The effects of varying applied UV-doses and aperture diameters on the formation of microlens arrays are described. The simulated surface profile shows a good agreement with the experimentally observed surface profiles of the microstructures. The paper demonstrates the ease with which a microlens array can be fabricated by backside exposure technique using Fraunhofer diffraction. More... »

PAGES

1285-1290

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/s00542-007-0510-2

DOI

http://dx.doi.org/10.1007/s00542-007-0510-2

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1017118054


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