Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

1991-10

AUTHORS

K. L. N. Phani, S. Mohan, R. Venkatachalam

ABSTRACT

Cyclic voltammetric responses of electrochemically treated polycrystalline gold surfaces have been examined using Cu-UPD probe reactions (UPD-underpotential deposition). The treatment procedure used appears to induce preferential crystal orientation of the Au surface with a very small roughness factor and affords a simple method to obtain well-defined surfaces for electrochemical studies.

PAGES

677-683

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/bf02841069

DOI

http://dx.doi.org/10.1007/bf02841069

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1086036328


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