Low-temperature metal-organic chemical vapor deposition (LTMOCVD) of device-quality copper films for microelectronic applications View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

1990-03

AUTHORS

Alain E. Kaloyeros, Aiguo Feng, Jonathan Garhart, Kenneth C. Brooks, Sumanta K. Ghosh, Arjun N. Saxena, Fred Luehrs

ABSTRACT

Copper films for potential use in multilevel metallization in ULSIC’s were produced by low temperature (250–350° C) metal-organic chemical vapor deposition (LTMOCVD) in atmospheres of pure H2 or mixture Ar/H2 from the β-diketonate precursor bis(1,1,1,5,5,5-hexafluoroacetylacetonato) copper(ll), Cu(hfa)2. The films were analyzed by x-ray diffraction (XRD), Rutherford backscattering (RBS), Auger electron spectroscopy (AES), scanning electron microscopy (SEM), and energy-dispersive x-ray spectroscopy (EDXS). The results of these studies showed that the films were uniform, continuous, adherent and highly pure—oxygen and carbon contents were below the detection limits of AES. Four point resistivity measurements showed that the copper films had very low resistivity, as low as 1.9 μΩcm for the films deposited in pure hydrogen atmosphere. Our preliminary results seem to indicate that LTMOCVD is a very attractive technique for copper multilevel metallizations. More... »

PAGES

271-276

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/bf02733818

DOI

http://dx.doi.org/10.1007/bf02733818

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1026974227


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0306", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Physical Chemistry (incl. Structural)", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/03", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Chemical Sciences", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "University at Albany, State University of New York", 
          "id": "https://www.grid.ac/institutes/grid.265850.c", 
          "name": [
            "Department of Physics, State University of New York at Albany, 12222, Albany, New York"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Kaloyeros", 
        "givenName": "Alain E.", 
        "id": "sg:person.011710503670.00", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011710503670.00"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "University at Albany, State University of New York", 
          "id": "https://www.grid.ac/institutes/grid.265850.c", 
          "name": [
            "Department of Physics, State University of New York at Albany, 12222, Albany, New York"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Feng", 
        "givenName": "Aiguo", 
        "id": "sg:person.015641447074.20", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015641447074.20"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "University at Albany, State University of New York", 
          "id": "https://www.grid.ac/institutes/grid.265850.c", 
          "name": [
            "Department of Physics, State University of New York at Albany, 12222, Albany, New York"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Garhart", 
        "givenName": "Jonathan", 
        "id": "sg:person.014122256605.46", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014122256605.46"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "University of Illinois at Urbana Champaign", 
          "id": "https://www.grid.ac/institutes/grid.35403.31", 
          "name": [
            "Department of Chemistry, University of Illinois at Urbana-Champaign, 61801, Urbana, Illinois"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Brooks", 
        "givenName": "Kenneth C.", 
        "id": "sg:person.013517240674.10", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.013517240674.10"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Rensselaer Polytechnic Institute", 
          "id": "https://www.grid.ac/institutes/grid.33647.35", 
          "name": [
            "Center for Integrated Electronics, Rensselaer Polytechnic Institute, 12180, Troy, NY"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Ghosh", 
        "givenName": "Sumanta K.", 
        "id": "sg:person.015657653345.45", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015657653345.45"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Rensselaer Polytechnic Institute", 
          "id": "https://www.grid.ac/institutes/grid.33647.35", 
          "name": [
            "Center for Integrated Electronics, Rensselaer Polytechnic Institute, 12180, Troy, NY"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Saxena", 
        "givenName": "Arjun N.", 
        "id": "sg:person.011277010345.44", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011277010345.44"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "name": [
            "Jordan Valley Applied Radiation, Inc., 44039, North Ridgeville, OH"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Luehrs", 
        "givenName": "Fred", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1007/bf02655348", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003056226", 
          "https://doi.org/10.1007/bf02655348"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf02655348", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003056226", 
          "https://doi.org/10.1007/bf02655348"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(86)90352-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003647848"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(86)90352-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1003647848"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0169-4332(89)90905-7", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1007785941"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1149/1.2096587", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1008170765"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1149/1.2423376", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1011137264"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1149/1.2096738", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1011352612"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/jmr.1987.0697", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018340192"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1149/1.2096498", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1018709340"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(89)90006-0", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1023677100"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(89)90006-0", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1023677100"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0010-8545(00)80433-6", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1030065166"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0022-0248(86)90356-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1030097964"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0022-0248(86)90356-8", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1030097964"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(88)90334-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1044737750"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(88)90334-3", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1044737750"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0169-4332(89)90904-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1051881151"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1021/cm00001a004", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1055405820"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1063/1.100823", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1057648409"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1063/1.1139698", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1057667197"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1063/1.91345", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1058131484"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1063/1.95811", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1058135947"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1116/1.584191", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1062194238"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/s0883769400063909", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1067964999"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1557/s088376940006440x", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1067965040"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "1990-03", 
    "datePublishedReg": "1990-03-01", 
    "description": "Copper films for potential use in multilevel metallization in ULSIC\u2019s were produced by low temperature (250\u2013350\u00b0 C) metal-organic chemical vapor deposition (LTMOCVD) in atmospheres of pure H2 or mixture Ar/H2 from the \u03b2-diketonate precursor bis(1,1,1,5,5,5-hexafluoroacetylacetonato) copper(ll), Cu(hfa)2. The films were analyzed by x-ray diffraction (XRD), Rutherford backscattering (RBS), Auger electron spectroscopy (AES), scanning electron microscopy (SEM), and energy-dispersive x-ray spectroscopy (EDXS). The results of these studies showed that the films were uniform, continuous, adherent and highly pure\u2014oxygen and carbon contents were below the detection limits of AES. Four point resistivity measurements showed that the copper films had very low resistivity, as low as 1.9 \u03bc\u03a9cm for the films deposited in pure hydrogen atmosphere. Our preliminary results seem to indicate that LTMOCVD is a very attractive technique for copper multilevel metallizations.", 
    "genre": "research_article", 
    "id": "sg:pub.10.1007/bf02733818", 
    "inLanguage": [
      "en"
    ], 
    "isAccessibleForFree": false, 
    "isPartOf": [
      {
        "id": "sg:journal.1136213", 
        "issn": [
          "0361-5235", 
          "1543-186X"
        ], 
        "name": "Journal of Electronic Materials", 
        "type": "Periodical"
      }, 
      {
        "issueNumber": "3", 
        "type": "PublicationIssue"
      }, 
      {
        "type": "PublicationVolume", 
        "volumeNumber": "19"
      }
    ], 
    "name": "Low-temperature metal-organic chemical vapor deposition (LTMOCVD) of device-quality copper films for microelectronic applications", 
    "pagination": "271-276", 
    "productId": [
      {
        "name": "readcube_id", 
        "type": "PropertyValue", 
        "value": [
          "807fbb7a38f6604acde67a965f090fd6d8edd01b88b4a82f71bf9533fa8dfa9d"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/bf02733818"
        ]
      }, 
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1026974227"
        ]
      }
    ], 
    "sameAs": [
      "https://doi.org/10.1007/bf02733818", 
      "https://app.dimensions.ai/details/publication/pub.1026974227"
    ], 
    "sdDataset": "articles", 
    "sdDatePublished": "2019-04-11T13:36", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000370_0000000370/records_46779_00000001.jsonl", 
    "type": "ScholarlyArticle", 
    "url": "http://link.springer.com/10.1007%2FBF02733818"
  }
]
 

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This table displays all metadata directly associated to this object as RDF triples.

174 TRIPLES      21 PREDICATES      48 URIs      19 LITERALS      7 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/bf02733818 schema:about anzsrc-for:03
2 anzsrc-for:0306
3 schema:author Nefd04c8767364612bd587f6bafd5debf
4 schema:citation sg:pub.10.1007/bf02655348
5 https://doi.org/10.1016/0022-0248(86)90356-8
6 https://doi.org/10.1016/0040-6090(86)90352-4
7 https://doi.org/10.1016/0040-6090(88)90334-3
8 https://doi.org/10.1016/0040-6090(89)90006-0
9 https://doi.org/10.1016/0169-4332(89)90904-5
10 https://doi.org/10.1016/0169-4332(89)90905-7
11 https://doi.org/10.1016/s0010-8545(00)80433-6
12 https://doi.org/10.1021/cm00001a004
13 https://doi.org/10.1063/1.100823
14 https://doi.org/10.1063/1.1139698
15 https://doi.org/10.1063/1.91345
16 https://doi.org/10.1063/1.95811
17 https://doi.org/10.1116/1.584191
18 https://doi.org/10.1149/1.2096498
19 https://doi.org/10.1149/1.2096587
20 https://doi.org/10.1149/1.2096738
21 https://doi.org/10.1149/1.2423376
22 https://doi.org/10.1557/jmr.1987.0697
23 https://doi.org/10.1557/s0883769400063909
24 https://doi.org/10.1557/s088376940006440x
25 schema:datePublished 1990-03
26 schema:datePublishedReg 1990-03-01
27 schema:description Copper films for potential use in multilevel metallization in ULSIC’s were produced by low temperature (250–350° C) metal-organic chemical vapor deposition (LTMOCVD) in atmospheres of pure H2 or mixture Ar/H2 from the β-diketonate precursor bis(1,1,1,5,5,5-hexafluoroacetylacetonato) copper(ll), Cu(hfa)2. The films were analyzed by x-ray diffraction (XRD), Rutherford backscattering (RBS), Auger electron spectroscopy (AES), scanning electron microscopy (SEM), and energy-dispersive x-ray spectroscopy (EDXS). The results of these studies showed that the films were uniform, continuous, adherent and highly pure—oxygen and carbon contents were below the detection limits of AES. Four point resistivity measurements showed that the copper films had very low resistivity, as low as 1.9 μΩcm for the films deposited in pure hydrogen atmosphere. Our preliminary results seem to indicate that LTMOCVD is a very attractive technique for copper multilevel metallizations.
28 schema:genre research_article
29 schema:inLanguage en
30 schema:isAccessibleForFree false
31 schema:isPartOf N9f3442d514424e1191513f127cce1945
32 Na98708ce6ed74344bfd73c20e4b9a4f0
33 sg:journal.1136213
34 schema:name Low-temperature metal-organic chemical vapor deposition (LTMOCVD) of device-quality copper films for microelectronic applications
35 schema:pagination 271-276
36 schema:productId N481cd3059eae4415b324a7f58e788215
37 N80314185302240f1bf62057fb97a17e6
38 Nd2f7026c50884662a439e6b502b9dd0e
39 schema:sameAs https://app.dimensions.ai/details/publication/pub.1026974227
40 https://doi.org/10.1007/bf02733818
41 schema:sdDatePublished 2019-04-11T13:36
42 schema:sdLicense https://scigraph.springernature.com/explorer/license/
43 schema:sdPublisher N1ee18339df194dfeba742ff7962b0fa9
44 schema:url http://link.springer.com/10.1007%2FBF02733818
45 sgo:license sg:explorer/license/
46 sgo:sdDataset articles
47 rdf:type schema:ScholarlyArticle
48 N03516c60ab924c8f9aaa982496a8a34f schema:name Jordan Valley Applied Radiation, Inc., 44039, North Ridgeville, OH
49 rdf:type schema:Organization
50 N11b91d8923284abb80f868f79745d5ed rdf:first sg:person.014122256605.46
51 rdf:rest Nf5467a9b9b7341889ff2d8b398f73a62
52 N1ee18339df194dfeba742ff7962b0fa9 schema:name Springer Nature - SN SciGraph project
53 rdf:type schema:Organization
54 N481cd3059eae4415b324a7f58e788215 schema:name dimensions_id
55 schema:value pub.1026974227
56 rdf:type schema:PropertyValue
57 N563208e709fb459ca440897390a5558b schema:affiliation N03516c60ab924c8f9aaa982496a8a34f
58 schema:familyName Luehrs
59 schema:givenName Fred
60 rdf:type schema:Person
61 N80314185302240f1bf62057fb97a17e6 schema:name doi
62 schema:value 10.1007/bf02733818
63 rdf:type schema:PropertyValue
64 N9f3442d514424e1191513f127cce1945 schema:volumeNumber 19
65 rdf:type schema:PublicationVolume
66 Na92daf34cfa34f3b9c48e5f35052d1b0 rdf:first sg:person.011277010345.44
67 rdf:rest Nfa5994cf1ca14b09a56a3bae29eefd7c
68 Na98708ce6ed74344bfd73c20e4b9a4f0 schema:issueNumber 3
69 rdf:type schema:PublicationIssue
70 Nab02b5c1a8414bc197251649b5f5899d rdf:first sg:person.015641447074.20
71 rdf:rest N11b91d8923284abb80f868f79745d5ed
72 Nd195d38ce9f743628173ff0b58719484 rdf:first sg:person.015657653345.45
73 rdf:rest Na92daf34cfa34f3b9c48e5f35052d1b0
74 Nd2f7026c50884662a439e6b502b9dd0e schema:name readcube_id
75 schema:value 807fbb7a38f6604acde67a965f090fd6d8edd01b88b4a82f71bf9533fa8dfa9d
76 rdf:type schema:PropertyValue
77 Nefd04c8767364612bd587f6bafd5debf rdf:first sg:person.011710503670.00
78 rdf:rest Nab02b5c1a8414bc197251649b5f5899d
79 Nf5467a9b9b7341889ff2d8b398f73a62 rdf:first sg:person.013517240674.10
80 rdf:rest Nd195d38ce9f743628173ff0b58719484
81 Nfa5994cf1ca14b09a56a3bae29eefd7c rdf:first N563208e709fb459ca440897390a5558b
82 rdf:rest rdf:nil
83 anzsrc-for:03 schema:inDefinedTermSet anzsrc-for:
84 schema:name Chemical Sciences
85 rdf:type schema:DefinedTerm
86 anzsrc-for:0306 schema:inDefinedTermSet anzsrc-for:
87 schema:name Physical Chemistry (incl. Structural)
88 rdf:type schema:DefinedTerm
89 sg:journal.1136213 schema:issn 0361-5235
90 1543-186X
91 schema:name Journal of Electronic Materials
92 rdf:type schema:Periodical
93 sg:person.011277010345.44 schema:affiliation https://www.grid.ac/institutes/grid.33647.35
94 schema:familyName Saxena
95 schema:givenName Arjun N.
96 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011277010345.44
97 rdf:type schema:Person
98 sg:person.011710503670.00 schema:affiliation https://www.grid.ac/institutes/grid.265850.c
99 schema:familyName Kaloyeros
100 schema:givenName Alain E.
101 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011710503670.00
102 rdf:type schema:Person
103 sg:person.013517240674.10 schema:affiliation https://www.grid.ac/institutes/grid.35403.31
104 schema:familyName Brooks
105 schema:givenName Kenneth C.
106 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.013517240674.10
107 rdf:type schema:Person
108 sg:person.014122256605.46 schema:affiliation https://www.grid.ac/institutes/grid.265850.c
109 schema:familyName Garhart
110 schema:givenName Jonathan
111 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014122256605.46
112 rdf:type schema:Person
113 sg:person.015641447074.20 schema:affiliation https://www.grid.ac/institutes/grid.265850.c
114 schema:familyName Feng
115 schema:givenName Aiguo
116 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015641447074.20
117 rdf:type schema:Person
118 sg:person.015657653345.45 schema:affiliation https://www.grid.ac/institutes/grid.33647.35
119 schema:familyName Ghosh
120 schema:givenName Sumanta K.
121 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015657653345.45
122 rdf:type schema:Person
123 sg:pub.10.1007/bf02655348 schema:sameAs https://app.dimensions.ai/details/publication/pub.1003056226
124 https://doi.org/10.1007/bf02655348
125 rdf:type schema:CreativeWork
126 https://doi.org/10.1016/0022-0248(86)90356-8 schema:sameAs https://app.dimensions.ai/details/publication/pub.1030097964
127 rdf:type schema:CreativeWork
128 https://doi.org/10.1016/0040-6090(86)90352-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1003647848
129 rdf:type schema:CreativeWork
130 https://doi.org/10.1016/0040-6090(88)90334-3 schema:sameAs https://app.dimensions.ai/details/publication/pub.1044737750
131 rdf:type schema:CreativeWork
132 https://doi.org/10.1016/0040-6090(89)90006-0 schema:sameAs https://app.dimensions.ai/details/publication/pub.1023677100
133 rdf:type schema:CreativeWork
134 https://doi.org/10.1016/0169-4332(89)90904-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1051881151
135 rdf:type schema:CreativeWork
136 https://doi.org/10.1016/0169-4332(89)90905-7 schema:sameAs https://app.dimensions.ai/details/publication/pub.1007785941
137 rdf:type schema:CreativeWork
138 https://doi.org/10.1016/s0010-8545(00)80433-6 schema:sameAs https://app.dimensions.ai/details/publication/pub.1030065166
139 rdf:type schema:CreativeWork
140 https://doi.org/10.1021/cm00001a004 schema:sameAs https://app.dimensions.ai/details/publication/pub.1055405820
141 rdf:type schema:CreativeWork
142 https://doi.org/10.1063/1.100823 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057648409
143 rdf:type schema:CreativeWork
144 https://doi.org/10.1063/1.1139698 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057667197
145 rdf:type schema:CreativeWork
146 https://doi.org/10.1063/1.91345 schema:sameAs https://app.dimensions.ai/details/publication/pub.1058131484
147 rdf:type schema:CreativeWork
148 https://doi.org/10.1063/1.95811 schema:sameAs https://app.dimensions.ai/details/publication/pub.1058135947
149 rdf:type schema:CreativeWork
150 https://doi.org/10.1116/1.584191 schema:sameAs https://app.dimensions.ai/details/publication/pub.1062194238
151 rdf:type schema:CreativeWork
152 https://doi.org/10.1149/1.2096498 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018709340
153 rdf:type schema:CreativeWork
154 https://doi.org/10.1149/1.2096587 schema:sameAs https://app.dimensions.ai/details/publication/pub.1008170765
155 rdf:type schema:CreativeWork
156 https://doi.org/10.1149/1.2096738 schema:sameAs https://app.dimensions.ai/details/publication/pub.1011352612
157 rdf:type schema:CreativeWork
158 https://doi.org/10.1149/1.2423376 schema:sameAs https://app.dimensions.ai/details/publication/pub.1011137264
159 rdf:type schema:CreativeWork
160 https://doi.org/10.1557/jmr.1987.0697 schema:sameAs https://app.dimensions.ai/details/publication/pub.1018340192
161 rdf:type schema:CreativeWork
162 https://doi.org/10.1557/s0883769400063909 schema:sameAs https://app.dimensions.ai/details/publication/pub.1067964999
163 rdf:type schema:CreativeWork
164 https://doi.org/10.1557/s088376940006440x schema:sameAs https://app.dimensions.ai/details/publication/pub.1067965040
165 rdf:type schema:CreativeWork
166 https://www.grid.ac/institutes/grid.265850.c schema:alternateName University at Albany, State University of New York
167 schema:name Department of Physics, State University of New York at Albany, 12222, Albany, New York
168 rdf:type schema:Organization
169 https://www.grid.ac/institutes/grid.33647.35 schema:alternateName Rensselaer Polytechnic Institute
170 schema:name Center for Integrated Electronics, Rensselaer Polytechnic Institute, 12180, Troy, NY
171 rdf:type schema:Organization
172 https://www.grid.ac/institutes/grid.35403.31 schema:alternateName University of Illinois at Urbana Champaign
173 schema:name Department of Chemistry, University of Illinois at Urbana-Champaign, 61801, Urbana, Illinois
174 rdf:type schema:Organization
 




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