Solidification rate in rapid conduction cooling View Full Text


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Article Info

DATE

1975-01

AUTHORS

Paul H. Shingu, Ryohei Ozaki

ABSTRACT

The ability of rapid conduction cooling to produce new non-equilibrium phases is examined with particular attention on solidification rate. By matching the rate of solidification calculated numerically from the heat flow balance with the crystal growth rate calculated by a kinetic equation, the kinetic undercooling for a given experimental condition is estimated. A limiting condition of cooling is presented in which the cooling rate is so large that the crystal growth cannot cover the whole sample body before it is cooled down to a low temperature where the growth rate of the crystal is negligibly small. More... »

PAGES

33-37

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/bf02673667

DOI

http://dx.doi.org/10.1007/bf02673667

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1050523275


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