Solder flow on narrow copper strips View Full Text


Ontology type: schema:ScholarlyArticle     


Article Info

DATE

1996-07

AUTHORS

F. M. Hosking, F. G. Yost, E. A. Holm, J. R. Michael

ABSTRACT

Various solderability tests have been developed over the years to quantify the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, 8) connected to a circular metal pad (radius, rc). Solder flow from the pad onto the strip depends on the geometric relationship between 8 and rc. Test methodology, experimental results, and validation of a flow model are presented in this paper. More... »

PAGES

1099-1107

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/bf02659910

DOI

http://dx.doi.org/10.1007/bf02659910

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1000712452


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