Transgranular stress-corrosion cracking of disordered Cu-25Au in aqueous chloride and sulfate media View Full Text


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Article Info

DATE

1988-02

AUTHORS

T. B. Cassagne, W. F. Flanagan, B. D. Lichter

ABSTRACT

Transgranular stress-corrosion cracking (T-SCC) in disordered copper-25 at. pct gold single crystals was studied in two chloride media: 2 pct (0.13 M) FeCl3 and oxygen-free 0.6 M NaCl. A limited number of tests were also performed on polycrystals in the chloride media and also in acidified 1 M Na2SO4. Potentiostatic polarization, constant deflection tests, and high-resolution SEM examination were used to relate the electrochemical and fractographic features of T-SCC in these systems. Exclusive selective electro-dissolution of copper occurs over the potential domain investigated, and the polarization behavior is characterized at low potentials by a “passive≓ domain in which the current is very low (2 to 4 microamps/cm2), increasing only very slowly with increasing potential up to a “transpassive” potential,Ec. AboveEc the current increases by a factor of 103 in a very narrow domain of rising potential ( ≈ 50 mv). In both chloride media Ec was found to be +430 mv (sce). At and above Ec a porous gold-rich “sponge” is readily formed on the surface, and in aq. FeCl3 metallographic evidence for sponge formation was also found in the low-current region of potential, well below Ec. In all three media, fracture surfaces display the characteristic cleavage-like features scen in other T-SCC systems. For the constant deflection loading employed in the present investigation, the lower limit of potential for susceptibility to cracking in aq. NaCl occurs at +400 mv (sce), which is slightly below Ec; whereas, for aq. FeCl3 the limiting potential is 0 mv (sce), considerably belowEc. For both chloride media, the upper limit, if it exists, is greater than +600 mv (sce). These results are analyzed in order to distinguish between proposed mechanisms for T-SCC. More... »

PAGES

281-292

References to SciGraph publications

  • 1983. On the Propagation of Transgranular Stress-Corrosion Cracks in ATOMISTICS OF FRACTURE
  • 1986-04. On the failure mechanism of chemically embrittled Cu3Au single crystals in METALLURGICAL AND MATERIALS TRANSACTIONS A
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    http://scigraph.springernature.com/pub.10.1007/bf02652537

    DOI

    http://dx.doi.org/10.1007/bf02652537

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