Interlamellar Spacing in Directionally Solidified Eutectic Thin Films View Full Text


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Article Info

DATE

1984-06-01

AUTHORS

H. E. Cline

ABSTRACT

Fault-free lamellar structures were grown in eutectic thin films of Pb-Sn, Cd-Pb, and Al-Al2Cu. The 2 μ thick films were directionally solidified by either a scanning laser or a quartz iodine lamp. A thermal gradient at the solid-liquid interface was estimated to be 8000°C/cm for the laser heat source compared to 200°C/cm for the lamp. In each alloy the lamellar spacing was larger than values estimated from previous experiments with bulk material. Defects in the films were observed to generate V-shaped waves of bent plates that provide a mechanism for increasing the lamellar spacing. Computer-simulated microstructures for two dimensional lamellar growth were made by calculating the diffusion in the liquid ahead of an irregular lamellar structure assuming a planar interface, finding the shape of the solid-liquid interface, and finding the trajectories of the three phase junctions. The mechanism of two-dimensional eutectic growth was discussed. More... »

PAGES

1013-1017

References to SciGraph publications

  • 1974-05. Capillary effects in the growth of thin Pb-Sn eutectic specimens in METALLURGICAL AND MATERIALS TRANSACTIONS B
  • Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/bf02644693

    DOI

    http://dx.doi.org/10.1007/bf02644693

    DIMENSIONS

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