The effects of stabilizing additives on the microstructure and properties of electroless copper deposits View Full Text


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Article Info

DATE

1974-05

AUTHORS

T. L. Aycock, N. C. Huie, George Krauss

ABSTRACT

The microstructure and physical properties of copper deposits from an EDTA complexed electroless solution maintained at 50°C and stabilized with either sodium cyanide, 2-mer-captobenzothiazole, or vanadium pentoxide were studied. Copper thicknesses up to 25 microns were plated on pretreated epoxy glass substrates. Scanning electron microscopy showed that the NaCN stabilized baths produced deposits with faceted particles 1 to 5 microns in diameter, the V2O5 baths produced deposits with needlelike particles less than 1 micron in diameter, and the deposit surfaces from the MBT stabilized baths consisted of separated clusters of columnar growths 10 to 50 microns in diameter and 20 to 80 microns high. Sulfur content of 0.2 pct was found in the deposits from the MBT stabilized baths by electron microprobe analysis. The electrical resistivities of all the deposits were measured with a four-point probe and found to be approximately 2 micro-ohm-cm at thicknesses above 25 microns. All the deposits were brittle, but those from the NaCN baths were less brittle than the deposits from the V2O5 and MBT baths. A spiral contractometer was used to measure the residual internal stresses. These stresses were 700 kg/cm2 compressive for the deposits from the NaCN baths and 350 kg/cm2 compressive for the deposits from the V2O5 baths. The deposits from the MBT stabilized baths developed residual tensile stresses that decreased to 150 kg/cm2 with increasing thickness. More... »

PAGES

1215-1223

Journal

TITLE

Metallurgical Transactions A

ISSUE

5

VOLUME

5

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/bf02644336

DOI

http://dx.doi.org/10.1007/bf02644336

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1052778917


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