High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

2010-01-23

AUTHORS

Nils Hoivik , He Liu , Kaiying Wang , Guttorm Salomonsen , Knut Aasmundtveit

ABSTRACT

The desire to directly integrate MEMS with ASICs in a 3D stack is the main motivation behind the development of a bonding technology suitable for both interconnects and seal rings. SLID (Solid–Liquid Inter-Diffusion) bonding processes based upon Au–Sn and Cu–Sn (high melting point metal/low melting point metal) are therefore investigated. SLID bonding allows for repeated high temperature processing cycles as in the case for chip stacking, or for interconnections and seal rings bonded at different process steps. This work describes results obtained for fluxless bonding of SLID Au–Sn and Cu–Sn interconnects and seal rings, where a thin layer of intermetallic compound (IMC) on the Cu or Sn surface protects the metal surfaces from oxidizing at elevated temperatures. To evaluate the bond strength, test dies bonded at various temperatures were subjected to SEM/EDX bond line analysis, and shear testing at both room and elevated temperatures. Au–Sn samples bonded at 280°C re-melt at elevated temperatures; whereas samples bonded at 350°C remain intact past the initial bonding temperature. For the Cu–Sn samples, the measured shear strength is comparable to conventionally bonded interconnects. In order to remain within the uniformity requirements for SLID bonding, the pattern density of electroplated interconnects and seal rings require an optimized layout which can be calculated based upon the effective area. More... »

PAGES

179-190

Book

TITLE

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

ISBN

978-90-481-3805-0
978-90-481-3807-4

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/978-90-481-3807-4_14

DOI

http://dx.doi.org/10.1007/978-90-481-3807-4_14

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1025576332


Indexing Status Check whether this publication has been indexed by Scopus and Web Of Science using the SN Indexing Status Tool
Incoming Citations Browse incoming citations for this publication using opencitations.net

JSON-LD is the canonical representation for SciGraph data.

TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "Vestfold University College", 
          "id": "https://www.grid.ac/institutes/grid.412820.d", 
          "name": [
            "Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Hoivik", 
        "givenName": "Nils", 
        "id": "sg:person.011647117334.38", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011647117334.38"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Vestfold University College", 
          "id": "https://www.grid.ac/institutes/grid.412820.d", 
          "name": [
            "Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Liu", 
        "givenName": "He", 
        "id": "sg:person.014441407553.55", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014441407553.55"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Vestfold University College", 
          "id": "https://www.grid.ac/institutes/grid.412820.d", 
          "name": [
            "Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Wang", 
        "givenName": "Kaiying", 
        "id": "sg:person.011352334661.29", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011352334661.29"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Vestfold University College", 
          "id": "https://www.grid.ac/institutes/grid.412820.d", 
          "name": [
            "Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Salomonsen", 
        "givenName": "Guttorm", 
        "id": "sg:person.015236770153.07", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015236770153.07"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Vestfold University College", 
          "id": "https://www.grid.ac/institutes/grid.412820.d", 
          "name": [
            "Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Aasmundtveit", 
        "givenName": "Knut", 
        "id": "sg:person.01077124237.74", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01077124237.74"
        ], 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "https://doi.org/10.1016/j.msea.2006.10.160", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1001468990"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0040-6090(95)08502-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1005025217"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(92)90643-p", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1010263425"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0040-6090(92)90643-p", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1010263425"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.mee.2006.09.026", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1012529977"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.scriptamat.2007.11.020", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1019344890"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/j.actamat.2004.02.033", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1037009596"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/estc.2008.4684511", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1093531637"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/isapm.2007.4419940", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1093996791"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2010-01-23", 
    "datePublishedReg": "2010-01-23", 
    "description": "The desire to directly integrate MEMS with ASICs in a 3D stack is the main motivation behind the development of a bonding technology suitable for both interconnects and seal rings. SLID (Solid\u2013Liquid Inter-Diffusion) bonding processes based upon Au\u2013Sn and Cu\u2013Sn (high melting point metal/low melting point metal) are therefore investigated. SLID bonding allows for repeated high temperature processing cycles as in the case for chip stacking, or for interconnections and seal rings bonded at different process steps. This work describes results obtained for fluxless bonding of SLID Au\u2013Sn and Cu\u2013Sn interconnects and seal rings, where a thin layer of intermetallic compound (IMC) on the Cu or Sn surface protects the metal surfaces from oxidizing at elevated temperatures. To evaluate the bond strength, test dies bonded at various temperatures were subjected to SEM/EDX bond line analysis, and shear testing at both room and elevated temperatures. Au\u2013Sn samples bonded at 280\u00b0C re-melt at elevated temperatures; whereas samples bonded at 350\u00b0C remain intact past the initial bonding temperature. For the Cu\u2013Sn samples, the measured shear strength is comparable to conventionally bonded interconnects. In order to remain within the uniformity requirements for SLID bonding, the pattern density of electroplated interconnects and seal rings require an optimized layout which can be calculated based upon the effective area.", 
    "editor": [
      {
        "familyName": "Gusev", 
        "givenName": "Evgeni", 
        "type": "Person"
      }, 
      {
        "familyName": "Garfunkel", 
        "givenName": "Eric", 
        "type": "Person"
      }, 
      {
        "familyName": "Dideikin", 
        "givenName": "Arthur", 
        "type": "Person"
      }
    ], 
    "genre": "chapter", 
    "id": "sg:pub.10.1007/978-90-481-3807-4_14", 
    "inLanguage": [
      "en"
    ], 
    "isAccessibleForFree": false, 
    "isPartOf": {
      "isbn": [
        "978-90-481-3805-0", 
        "978-90-481-3807-4"
      ], 
      "name": "Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators", 
      "type": "Book"
    }, 
    "name": "High-Temperature Stable Au\u2013Sn and Cu\u2013Sn Interconnects for 3D Stacked Applications", 
    "pagination": "179-190", 
    "productId": [
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1025576332"
        ]
      }, 
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/978-90-481-3807-4_14"
        ]
      }, 
      {
        "name": "readcube_id", 
        "type": "PropertyValue", 
        "value": [
          "79d8ce5bbc93a58d6ef833c9bc13f18f3913042eb038d8d696dfdc99a2d789cd"
        ]
      }
    ], 
    "publisher": {
      "location": "Dordrecht", 
      "name": "Springer Netherlands", 
      "type": "Organisation"
    }, 
    "sameAs": [
      "https://doi.org/10.1007/978-90-481-3807-4_14", 
      "https://app.dimensions.ai/details/publication/pub.1025576332"
    ], 
    "sdDataset": "chapters", 
    "sdDatePublished": "2019-04-16T07:37", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000357_0000000357/records_99316_00000001.jsonl", 
    "type": "Chapter", 
    "url": "https://link.springer.com/10.1007%2F978-90-481-3807-4_14"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

HOW TO GET THIS DATA PROGRAMMATICALLY:

JSON-LD is a popular format for linked data which is fully compatible with JSON.

curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/pub.10.1007/978-90-481-3807-4_14'

N-Triples is a line-based linked data format ideal for batch operations.

curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/pub.10.1007/978-90-481-3807-4_14'

Turtle is a human-readable linked data format.

curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/pub.10.1007/978-90-481-3807-4_14'

RDF/XML is a standard XML format for linked data.

curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/pub.10.1007/978-90-481-3807-4_14'


 

This table displays all metadata directly associated to this object as RDF triples.

127 TRIPLES      23 PREDICATES      34 URIs      19 LITERALS      8 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/978-90-481-3807-4_14 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author N0b6b51cd2f9a4e2d8b21f48ec3f0b3e9
4 schema:citation https://doi.org/10.1016/0040-6090(92)90643-p
5 https://doi.org/10.1016/j.actamat.2004.02.033
6 https://doi.org/10.1016/j.mee.2006.09.026
7 https://doi.org/10.1016/j.msea.2006.10.160
8 https://doi.org/10.1016/j.scriptamat.2007.11.020
9 https://doi.org/10.1016/s0040-6090(95)08502-5
10 https://doi.org/10.1109/estc.2008.4684511
11 https://doi.org/10.1109/isapm.2007.4419940
12 schema:datePublished 2010-01-23
13 schema:datePublishedReg 2010-01-23
14 schema:description The desire to directly integrate MEMS with ASICs in a 3D stack is the main motivation behind the development of a bonding technology suitable for both interconnects and seal rings. SLID (Solid–Liquid Inter-Diffusion) bonding processes based upon Au–Sn and Cu–Sn (high melting point metal/low melting point metal) are therefore investigated. SLID bonding allows for repeated high temperature processing cycles as in the case for chip stacking, or for interconnections and seal rings bonded at different process steps. This work describes results obtained for fluxless bonding of SLID Au–Sn and Cu–Sn interconnects and seal rings, where a thin layer of intermetallic compound (IMC) on the Cu or Sn surface protects the metal surfaces from oxidizing at elevated temperatures. To evaluate the bond strength, test dies bonded at various temperatures were subjected to SEM/EDX bond line analysis, and shear testing at both room and elevated temperatures. Au–Sn samples bonded at 280°C re-melt at elevated temperatures; whereas samples bonded at 350°C remain intact past the initial bonding temperature. For the Cu–Sn samples, the measured shear strength is comparable to conventionally bonded interconnects. In order to remain within the uniformity requirements for SLID bonding, the pattern density of electroplated interconnects and seal rings require an optimized layout which can be calculated based upon the effective area.
15 schema:editor N3e862046100d47c0a80d472655c2bf9c
16 schema:genre chapter
17 schema:inLanguage en
18 schema:isAccessibleForFree false
19 schema:isPartOf Nb3dc43def21e402791912a435926a659
20 schema:name High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications
21 schema:pagination 179-190
22 schema:productId N50dcee7787b84849b012b923243dc8fb
23 N65a70c5a7c044d1d94b36a2edef41527
24 N9587cfbc1e724a548ca99bea91d7514b
25 schema:publisher N05ea84987e4649a59a4e2b86f0d14a9a
26 schema:sameAs https://app.dimensions.ai/details/publication/pub.1025576332
27 https://doi.org/10.1007/978-90-481-3807-4_14
28 schema:sdDatePublished 2019-04-16T07:37
29 schema:sdLicense https://scigraph.springernature.com/explorer/license/
30 schema:sdPublisher N25c95200aaab427090d08c25214e14de
31 schema:url https://link.springer.com/10.1007%2F978-90-481-3807-4_14
32 sgo:license sg:explorer/license/
33 sgo:sdDataset chapters
34 rdf:type schema:Chapter
35 N05ea84987e4649a59a4e2b86f0d14a9a schema:location Dordrecht
36 schema:name Springer Netherlands
37 rdf:type schema:Organisation
38 N0b6b51cd2f9a4e2d8b21f48ec3f0b3e9 rdf:first sg:person.011647117334.38
39 rdf:rest N10ee969a82374c2190ac300b6fcad181
40 N10ee969a82374c2190ac300b6fcad181 rdf:first sg:person.014441407553.55
41 rdf:rest Nb7c9deaaacfd4389bb30be1cf7de1a32
42 N12e7210f1d714bb29f6ab5c16d62fdc6 schema:familyName Garfunkel
43 schema:givenName Eric
44 rdf:type schema:Person
45 N20d9652d2d784494ad2499ed2a5394a1 rdf:first N12e7210f1d714bb29f6ab5c16d62fdc6
46 rdf:rest Ndc09324bd1844dde86e327709b691a24
47 N25c95200aaab427090d08c25214e14de schema:name Springer Nature - SN SciGraph project
48 rdf:type schema:Organization
49 N38dc8480fea941e5b63b0c44cd5f84ed schema:familyName Dideikin
50 schema:givenName Arthur
51 rdf:type schema:Person
52 N3e862046100d47c0a80d472655c2bf9c rdf:first N6689be58eca04f0b9ccbae543b450790
53 rdf:rest N20d9652d2d784494ad2499ed2a5394a1
54 N50dcee7787b84849b012b923243dc8fb schema:name doi
55 schema:value 10.1007/978-90-481-3807-4_14
56 rdf:type schema:PropertyValue
57 N65a70c5a7c044d1d94b36a2edef41527 schema:name dimensions_id
58 schema:value pub.1025576332
59 rdf:type schema:PropertyValue
60 N6689be58eca04f0b9ccbae543b450790 schema:familyName Gusev
61 schema:givenName Evgeni
62 rdf:type schema:Person
63 N8829030831cd48198dc430a1cc3ba0b5 rdf:first sg:person.015236770153.07
64 rdf:rest Nf1b0d4d710e748e08476891d056aa71f
65 N9587cfbc1e724a548ca99bea91d7514b schema:name readcube_id
66 schema:value 79d8ce5bbc93a58d6ef833c9bc13f18f3913042eb038d8d696dfdc99a2d789cd
67 rdf:type schema:PropertyValue
68 Nb3dc43def21e402791912a435926a659 schema:isbn 978-90-481-3805-0
69 978-90-481-3807-4
70 schema:name Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
71 rdf:type schema:Book
72 Nb7c9deaaacfd4389bb30be1cf7de1a32 rdf:first sg:person.011352334661.29
73 rdf:rest N8829030831cd48198dc430a1cc3ba0b5
74 Ndc09324bd1844dde86e327709b691a24 rdf:first N38dc8480fea941e5b63b0c44cd5f84ed
75 rdf:rest rdf:nil
76 Nf1b0d4d710e748e08476891d056aa71f rdf:first sg:person.01077124237.74
77 rdf:rest rdf:nil
78 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
79 schema:name Engineering
80 rdf:type schema:DefinedTerm
81 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
82 schema:name Materials Engineering
83 rdf:type schema:DefinedTerm
84 sg:person.01077124237.74 schema:affiliation https://www.grid.ac/institutes/grid.412820.d
85 schema:familyName Aasmundtveit
86 schema:givenName Knut
87 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.01077124237.74
88 rdf:type schema:Person
89 sg:person.011352334661.29 schema:affiliation https://www.grid.ac/institutes/grid.412820.d
90 schema:familyName Wang
91 schema:givenName Kaiying
92 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011352334661.29
93 rdf:type schema:Person
94 sg:person.011647117334.38 schema:affiliation https://www.grid.ac/institutes/grid.412820.d
95 schema:familyName Hoivik
96 schema:givenName Nils
97 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011647117334.38
98 rdf:type schema:Person
99 sg:person.014441407553.55 schema:affiliation https://www.grid.ac/institutes/grid.412820.d
100 schema:familyName Liu
101 schema:givenName He
102 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014441407553.55
103 rdf:type schema:Person
104 sg:person.015236770153.07 schema:affiliation https://www.grid.ac/institutes/grid.412820.d
105 schema:familyName Salomonsen
106 schema:givenName Guttorm
107 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.015236770153.07
108 rdf:type schema:Person
109 https://doi.org/10.1016/0040-6090(92)90643-p schema:sameAs https://app.dimensions.ai/details/publication/pub.1010263425
110 rdf:type schema:CreativeWork
111 https://doi.org/10.1016/j.actamat.2004.02.033 schema:sameAs https://app.dimensions.ai/details/publication/pub.1037009596
112 rdf:type schema:CreativeWork
113 https://doi.org/10.1016/j.mee.2006.09.026 schema:sameAs https://app.dimensions.ai/details/publication/pub.1012529977
114 rdf:type schema:CreativeWork
115 https://doi.org/10.1016/j.msea.2006.10.160 schema:sameAs https://app.dimensions.ai/details/publication/pub.1001468990
116 rdf:type schema:CreativeWork
117 https://doi.org/10.1016/j.scriptamat.2007.11.020 schema:sameAs https://app.dimensions.ai/details/publication/pub.1019344890
118 rdf:type schema:CreativeWork
119 https://doi.org/10.1016/s0040-6090(95)08502-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1005025217
120 rdf:type schema:CreativeWork
121 https://doi.org/10.1109/estc.2008.4684511 schema:sameAs https://app.dimensions.ai/details/publication/pub.1093531637
122 rdf:type schema:CreativeWork
123 https://doi.org/10.1109/isapm.2007.4419940 schema:sameAs https://app.dimensions.ai/details/publication/pub.1093996791
124 rdf:type schema:CreativeWork
125 https://www.grid.ac/institutes/grid.412820.d schema:alternateName Vestfold University College
126 schema:name Institute of Microsystems Technology, Vestfold University College, Vestfold, Norway
127 rdf:type schema:Organization
 




Preview window. Press ESC to close (or click here)


...