The Simulation System for Three-Dimensional Capacitance and Current Density Calculation with a User Friendly GUI View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

1995

AUTHORS

M. Mukai , T. Tatsumi , N. Nakauchi , T. Kobayashi , K. Koyama , Y. Komatsu , R. Bauer , G. Rieger , S. Selberherr

ABSTRACT

For the realization of today’s wiring miniaturization, it is required to accurately estimate the interconnect wiring capacitance and the current density, which has not been so far adequately accomplished. We have developed SENECA, the three-dimensional wiring capacitance and current density simulation system with graphical user interface for easy and flexible operation. The realization of this graphical input interface made it possible to reduce the man power from more than three days work to less than 30 minutes for a practical structure. The comparison between simulation and experiment proves quite good agreement. Three important applications are given to show how SENECA is utilized for practical cases. More... »

PAGES

151-154

Book

TITLE

Simulation of Semiconductor Devices and Processes

ISBN

978-3-7091-7363-3
978-3-7091-6619-2

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/978-3-7091-6619-2_35

DOI

http://dx.doi.org/10.1007/978-3-7091-6619-2_35

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1025668051


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