Ontology type: schema:Chapter Open Access: True
2012
AUTHORSMatthias Mohaupt , Erik Beckert , Thomas Burkhardt , Marcel Hornaff , Christoph Damm , Ramona Eberhardt , Andreas Tünnermann , Hans-Joachim Döring , Klaus Reimer
ABSTRACTMulti shaped beam lithography requires the precise and durable alignment and fixation of MEMS based Multi Deflection Arrays on stable ceramic system platforms using vacuum and high temperature compatible interconnection and joining technologies. Micron accuracy during assembly is accomplished by mark detection using image processing and 3DOF alignment procedures; while interconnection as well as precise fixation is carried out using a fine pitch solder bumping process. Qualification investigations using electron beam equipment show that the precisely aligned multi shaped beam arrays are able to deflect the electron beams in accordance with the simulation results. More... »
PAGES42-50
Precision Assembly Technologies and Systems
ISBN
978-3-642-28162-4
978-3-642-28163-1
http://scigraph.springernature.com/pub.10.1007/978-3-642-28163-1_6
DOIhttp://dx.doi.org/10.1007/978-3-642-28163-1_6
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