Nano-underfills and Potting Compounds for Fine-Pitch Electronics View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

2018

AUTHORS

Pradeep Lall , Saiful Islam , Kalyan Dornala , Jeff Suhling , Darshan Shinde

ABSTRACT

Packaging materials undergo dimensional changes under environmental exposure to temperature change. Thermomechanical cyclic loads induce stresses and damage interconnects. Mechanical shock during operation may subject the board assemblies to large out-of-plane deformation. Underfills and potting compounds are often used to enhance the harsh environment reliability of electronics through addition of supplemental restraints to allow for increase in the design margins. The computational tools and experimental test methods for assessing the change in thermomechanical and mechanical shock reliability of fine-pitch electronics with supplemental restraints are discussed. Methods to model the mechanical properties of underfills using unit cell approaches for property prediction and viscoelastic models to capture the constitutive behavior along with experimental measurements of nano-underfills have been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed. More... »

PAGES

513-574

References to SciGraph publications

Book

TITLE

Nanopackaging

ISBN

978-3-319-90361-3
978-3-319-90362-0

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/978-3-319-90362-0_16

DOI

http://dx.doi.org/10.1007/978-3-319-90362-0_16

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1107186734


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[
  {
    "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
    "about": [
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/0912", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Materials Engineering", 
        "type": "DefinedTerm"
      }, 
      {
        "id": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/09", 
        "inDefinedTermSet": "http://purl.org/au-research/vocabulary/anzsrc-for/2008/", 
        "name": "Engineering", 
        "type": "DefinedTerm"
      }
    ], 
    "author": [
      {
        "affiliation": {
          "alternateName": "Auburn University System", 
          "id": "https://www.grid.ac/institutes/grid.411016.3", 
          "name": [
            "Auburn University"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Lall", 
        "givenName": "Pradeep", 
        "id": "sg:person.07707340653.33", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.07707340653.33"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "name": [
            "Intel Corporation"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Islam", 
        "givenName": "Saiful", 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Auburn University System", 
          "id": "https://www.grid.ac/institutes/grid.411016.3", 
          "name": [
            "Auburn University"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Dornala", 
        "givenName": "Kalyan", 
        "id": "sg:person.011444064677.95", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011444064677.95"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Auburn University System", 
          "id": "https://www.grid.ac/institutes/grid.411016.3", 
          "name": [
            "Auburn University"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Suhling", 
        "givenName": "Jeff", 
        "id": "sg:person.07716720655.32", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.07716720655.32"
        ], 
        "type": "Person"
      }, 
      {
        "affiliation": {
          "alternateName": "Auburn University System", 
          "id": "https://www.grid.ac/institutes/grid.411016.3", 
          "name": [
            "Auburn University"
          ], 
          "type": "Organization"
        }, 
        "familyName": "Shinde", 
        "givenName": "Darshan", 
        "type": "Person"
      }
    ], 
    "citation": [
      {
        "id": "sg:pub.10.1023/a:1024419508770", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1000855541", 
          "https://doi.org/10.1023/a:1024419508770"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf02708241", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002961656", 
          "https://doi.org/10.1007/bf02708241"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "sg:pub.10.1007/bf02708241", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1002961656", 
          "https://doi.org/10.1007/bf02708241"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0266-3538(94)90141-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1021736661"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0266-3538(94)90141-4", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1021736661"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0022-5096(99)00088-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1027830816"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0022-5096(02)00021-2", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1028305988"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/0022-5096(96)00007-5", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1028622912"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0032-5910(03)00042-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1048834138"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1016/s0032-5910(03)00042-1", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1048834138"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1063/1.1620373", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1057726557"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/6104.816104", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1061202003"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/tcapt.2006.870389", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1061539820"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/ectc.2005.1441269", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1094262681"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/itherm.2004.1318272", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1094767209"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/itherm.2006.1645443", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1095277619"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/isapm.2004.1288003", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1095446078"
        ], 
        "type": "CreativeWork"
      }, 
      {
        "id": "https://doi.org/10.1109/ectc.2001.927742", 
        "sameAs": [
          "https://app.dimensions.ai/details/publication/pub.1095548490"
        ], 
        "type": "CreativeWork"
      }
    ], 
    "datePublished": "2018", 
    "datePublishedReg": "2018-01-01", 
    "description": "Packaging materials undergo dimensional changes under environmental exposure to temperature change. Thermomechanical cyclic loads induce stresses and damage interconnects. Mechanical shock during operation may subject the board assemblies to large out-of-plane deformation. Underfills and potting compounds are often used to enhance the harsh environment reliability of electronics through addition of supplemental restraints to allow for increase in the design margins. The computational tools and experimental test methods for assessing the change in thermomechanical and mechanical shock reliability of fine-pitch electronics with supplemental restraints are discussed. Methods to model the mechanical properties of underfills using unit cell approaches for property prediction and viscoelastic models to capture the constitutive behavior along with experimental measurements of nano-underfills have been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed.", 
    "editor": [
      {
        "familyName": "Morris", 
        "givenName": "James E.", 
        "type": "Person"
      }
    ], 
    "genre": "chapter", 
    "id": "sg:pub.10.1007/978-3-319-90362-0_16", 
    "inLanguage": [
      "en"
    ], 
    "isAccessibleForFree": false, 
    "isPartOf": {
      "isbn": [
        "978-3-319-90361-3", 
        "978-3-319-90362-0"
      ], 
      "name": "Nanopackaging", 
      "type": "Book"
    }, 
    "name": "Nano-underfills and Potting Compounds for Fine-Pitch Electronics", 
    "pagination": "513-574", 
    "productId": [
      {
        "name": "doi", 
        "type": "PropertyValue", 
        "value": [
          "10.1007/978-3-319-90362-0_16"
        ]
      }, 
      {
        "name": "readcube_id", 
        "type": "PropertyValue", 
        "value": [
          "cc42e3b0aa95138460faf66fab4ba5a0ba7c853bda83b197a8835601f4fe2d28"
        ]
      }, 
      {
        "name": "dimensions_id", 
        "type": "PropertyValue", 
        "value": [
          "pub.1107186734"
        ]
      }
    ], 
    "publisher": {
      "location": "Cham", 
      "name": "Springer International Publishing", 
      "type": "Organisation"
    }, 
    "sameAs": [
      "https://doi.org/10.1007/978-3-319-90362-0_16", 
      "https://app.dimensions.ai/details/publication/pub.1107186734"
    ], 
    "sdDataset": "chapters", 
    "sdDatePublished": "2019-04-16T00:23", 
    "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
    "sdPublisher": {
      "name": "Springer Nature - SN SciGraph project", 
      "type": "Organization"
    }, 
    "sdSource": "s3://com-uberresearch-data-dimensions-target-20181106-alternative/cleanup/v134/2549eaecd7973599484d7c17b260dba0a4ecb94b/merge/v9/a6c9fde33151104705d4d7ff012ea9563521a3ce/jats-lookup/v90/0000000001_0000000264/records_8697_00000536.jsonl", 
    "type": "Chapter", 
    "url": "http://link.springer.com/10.1007/978-3-319-90362-0_16"
  }
]
 

Download the RDF metadata as:  json-ld nt turtle xml License info

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This table displays all metadata directly associated to this object as RDF triples.

140 TRIPLES      23 PREDICATES      42 URIs      20 LITERALS      8 BLANK NODES

Subject Predicate Object
1 sg:pub.10.1007/978-3-319-90362-0_16 schema:about anzsrc-for:09
2 anzsrc-for:0912
3 schema:author Nb9ca052edcf1469a962d791592125868
4 schema:citation sg:pub.10.1007/bf02708241
5 sg:pub.10.1023/a:1024419508770
6 https://doi.org/10.1016/0022-5096(96)00007-5
7 https://doi.org/10.1016/0266-3538(94)90141-4
8 https://doi.org/10.1016/s0022-5096(02)00021-2
9 https://doi.org/10.1016/s0022-5096(99)00088-5
10 https://doi.org/10.1016/s0032-5910(03)00042-1
11 https://doi.org/10.1063/1.1620373
12 https://doi.org/10.1109/6104.816104
13 https://doi.org/10.1109/ectc.2001.927742
14 https://doi.org/10.1109/ectc.2005.1441269
15 https://doi.org/10.1109/isapm.2004.1288003
16 https://doi.org/10.1109/itherm.2004.1318272
17 https://doi.org/10.1109/itherm.2006.1645443
18 https://doi.org/10.1109/tcapt.2006.870389
19 schema:datePublished 2018
20 schema:datePublishedReg 2018-01-01
21 schema:description Packaging materials undergo dimensional changes under environmental exposure to temperature change. Thermomechanical cyclic loads induce stresses and damage interconnects. Mechanical shock during operation may subject the board assemblies to large out-of-plane deformation. Underfills and potting compounds are often used to enhance the harsh environment reliability of electronics through addition of supplemental restraints to allow for increase in the design margins. The computational tools and experimental test methods for assessing the change in thermomechanical and mechanical shock reliability of fine-pitch electronics with supplemental restraints are discussed. Methods to model the mechanical properties of underfills using unit cell approaches for property prediction and viscoelastic models to capture the constitutive behavior along with experimental measurements of nano-underfills have been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed.
22 schema:editor N206038102da34ff5874c4f0ea34b2051
23 schema:genre chapter
24 schema:inLanguage en
25 schema:isAccessibleForFree false
26 schema:isPartOf Nc4fe970c513746ec9faa4474e34d2abb
27 schema:name Nano-underfills and Potting Compounds for Fine-Pitch Electronics
28 schema:pagination 513-574
29 schema:productId N105e141c754741d1b8e75a55e584266e
30 N474f4af5630c4d21afabf1b1e40578fa
31 Ne9ebd4a69596400c833542b1c15ad86e
32 schema:publisher N63ba37bb03784cb2a1a0e774d3ddc8d7
33 schema:sameAs https://app.dimensions.ai/details/publication/pub.1107186734
34 https://doi.org/10.1007/978-3-319-90362-0_16
35 schema:sdDatePublished 2019-04-16T00:23
36 schema:sdLicense https://scigraph.springernature.com/explorer/license/
37 schema:sdPublisher N2c5b8028490c449ab79cd40a4eb0b421
38 schema:url http://link.springer.com/10.1007/978-3-319-90362-0_16
39 sgo:license sg:explorer/license/
40 sgo:sdDataset chapters
41 rdf:type schema:Chapter
42 N105e141c754741d1b8e75a55e584266e schema:name readcube_id
43 schema:value cc42e3b0aa95138460faf66fab4ba5a0ba7c853bda83b197a8835601f4fe2d28
44 rdf:type schema:PropertyValue
45 N1a505c9dfc30440d9ff8e6b6cdc5a71f rdf:first sg:person.07716720655.32
46 rdf:rest Nee6a8bcccf6b43c680e01c3cda0a585f
47 N206038102da34ff5874c4f0ea34b2051 rdf:first N98e41e0f59394fb6b7284feaf844bff4
48 rdf:rest rdf:nil
49 N2c5b8028490c449ab79cd40a4eb0b421 schema:name Springer Nature - SN SciGraph project
50 rdf:type schema:Organization
51 N474f4af5630c4d21afabf1b1e40578fa schema:name doi
52 schema:value 10.1007/978-3-319-90362-0_16
53 rdf:type schema:PropertyValue
54 N63ba37bb03784cb2a1a0e774d3ddc8d7 schema:location Cham
55 schema:name Springer International Publishing
56 rdf:type schema:Organisation
57 N98e41e0f59394fb6b7284feaf844bff4 schema:familyName Morris
58 schema:givenName James E.
59 rdf:type schema:Person
60 Nb9ca052edcf1469a962d791592125868 rdf:first sg:person.07707340653.33
61 rdf:rest Nda2db65fb4cf48628c9a89b1f00bb0cb
62 Nc4fe970c513746ec9faa4474e34d2abb schema:isbn 978-3-319-90361-3
63 978-3-319-90362-0
64 schema:name Nanopackaging
65 rdf:type schema:Book
66 Nc7bffa390c8440ac9ef2ddd0f7b5e233 schema:name Intel Corporation
67 rdf:type schema:Organization
68 Nda2db65fb4cf48628c9a89b1f00bb0cb rdf:first Nec69307b1e44414fa9693410cecad410
69 rdf:rest Ne962e4fdc2f44f8e9a9ed42d4f5645fb
70 Ne962e4fdc2f44f8e9a9ed42d4f5645fb rdf:first sg:person.011444064677.95
71 rdf:rest N1a505c9dfc30440d9ff8e6b6cdc5a71f
72 Ne9ebd4a69596400c833542b1c15ad86e schema:name dimensions_id
73 schema:value pub.1107186734
74 rdf:type schema:PropertyValue
75 Nec69307b1e44414fa9693410cecad410 schema:affiliation Nc7bffa390c8440ac9ef2ddd0f7b5e233
76 schema:familyName Islam
77 schema:givenName Saiful
78 rdf:type schema:Person
79 Nee0dccd70e954ef79927e2f65bf83252 schema:affiliation https://www.grid.ac/institutes/grid.411016.3
80 schema:familyName Shinde
81 schema:givenName Darshan
82 rdf:type schema:Person
83 Nee6a8bcccf6b43c680e01c3cda0a585f rdf:first Nee0dccd70e954ef79927e2f65bf83252
84 rdf:rest rdf:nil
85 anzsrc-for:09 schema:inDefinedTermSet anzsrc-for:
86 schema:name Engineering
87 rdf:type schema:DefinedTerm
88 anzsrc-for:0912 schema:inDefinedTermSet anzsrc-for:
89 schema:name Materials Engineering
90 rdf:type schema:DefinedTerm
91 sg:person.011444064677.95 schema:affiliation https://www.grid.ac/institutes/grid.411016.3
92 schema:familyName Dornala
93 schema:givenName Kalyan
94 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.011444064677.95
95 rdf:type schema:Person
96 sg:person.07707340653.33 schema:affiliation https://www.grid.ac/institutes/grid.411016.3
97 schema:familyName Lall
98 schema:givenName Pradeep
99 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.07707340653.33
100 rdf:type schema:Person
101 sg:person.07716720655.32 schema:affiliation https://www.grid.ac/institutes/grid.411016.3
102 schema:familyName Suhling
103 schema:givenName Jeff
104 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.07716720655.32
105 rdf:type schema:Person
106 sg:pub.10.1007/bf02708241 schema:sameAs https://app.dimensions.ai/details/publication/pub.1002961656
107 https://doi.org/10.1007/bf02708241
108 rdf:type schema:CreativeWork
109 sg:pub.10.1023/a:1024419508770 schema:sameAs https://app.dimensions.ai/details/publication/pub.1000855541
110 https://doi.org/10.1023/a:1024419508770
111 rdf:type schema:CreativeWork
112 https://doi.org/10.1016/0022-5096(96)00007-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028622912
113 rdf:type schema:CreativeWork
114 https://doi.org/10.1016/0266-3538(94)90141-4 schema:sameAs https://app.dimensions.ai/details/publication/pub.1021736661
115 rdf:type schema:CreativeWork
116 https://doi.org/10.1016/s0022-5096(02)00021-2 schema:sameAs https://app.dimensions.ai/details/publication/pub.1028305988
117 rdf:type schema:CreativeWork
118 https://doi.org/10.1016/s0022-5096(99)00088-5 schema:sameAs https://app.dimensions.ai/details/publication/pub.1027830816
119 rdf:type schema:CreativeWork
120 https://doi.org/10.1016/s0032-5910(03)00042-1 schema:sameAs https://app.dimensions.ai/details/publication/pub.1048834138
121 rdf:type schema:CreativeWork
122 https://doi.org/10.1063/1.1620373 schema:sameAs https://app.dimensions.ai/details/publication/pub.1057726557
123 rdf:type schema:CreativeWork
124 https://doi.org/10.1109/6104.816104 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061202003
125 rdf:type schema:CreativeWork
126 https://doi.org/10.1109/ectc.2001.927742 schema:sameAs https://app.dimensions.ai/details/publication/pub.1095548490
127 rdf:type schema:CreativeWork
128 https://doi.org/10.1109/ectc.2005.1441269 schema:sameAs https://app.dimensions.ai/details/publication/pub.1094262681
129 rdf:type schema:CreativeWork
130 https://doi.org/10.1109/isapm.2004.1288003 schema:sameAs https://app.dimensions.ai/details/publication/pub.1095446078
131 rdf:type schema:CreativeWork
132 https://doi.org/10.1109/itherm.2004.1318272 schema:sameAs https://app.dimensions.ai/details/publication/pub.1094767209
133 rdf:type schema:CreativeWork
134 https://doi.org/10.1109/itherm.2006.1645443 schema:sameAs https://app.dimensions.ai/details/publication/pub.1095277619
135 rdf:type schema:CreativeWork
136 https://doi.org/10.1109/tcapt.2006.870389 schema:sameAs https://app.dimensions.ai/details/publication/pub.1061539820
137 rdf:type schema:CreativeWork
138 https://www.grid.ac/institutes/grid.411016.3 schema:alternateName Auburn University System
139 schema:name Auburn University
140 rdf:type schema:Organization
 




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