Mechanics of Wirebond Interconnects View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

1993

AUTHORS

Michael Pecht , Pradeep Lall

ABSTRACT

This chapter discusses the thermomechanical considerations in the manufacture and design of wirebond interconnects and presents guidelines for design of reliable wirebond interconnects. This section gives an overview of wirebonding technology, including bond types and representative geometries, typical metallurgical systems, considerations in wire selection, common methods of wirebond interconnect evaluation, and a list of observed wirebond failures. Section 22.2 discusses thermomechanical considerations during wirebond manufacture. Thermomechanical considerations concerning bonding process and common bonding problems are discussed, including cratering, pad cleanliness, intermetallic formation, metallization problems, pad lifting, bonding parameters, and geometries. The common post-bond test techniques used to assess the effect of thermomechanical stresses on bond performance are then discussed. Section 22.3 discusses thermomechanical considerations during the wirebond operation, including potential failure mechanisms and physics of failure models. Based on thermomechanical considerations during manufacture and use, outlined in Section 22.2 and 22.3, guidelines for design of reliable wirebond interconnects are presented in Section 22.4. More... »

PAGES

729-802

References to SciGraph publications

  • 1973-11. Annealing behavior of electrodeposited gold containing entrapments in JOURNAL OF ELECTRONIC MATERIALS
  • Book

    TITLE

    Thermal Stress and Strain in Microelectronics Packaging

    ISBN

    978-1-4684-7769-6
    978-1-4684-7767-2

    Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/978-1-4684-7767-2_22

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    http://dx.doi.org/10.1007/978-1-4684-7767-2_22

    DIMENSIONS

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