Advanced Soldering Processes View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

1993

AUTHORS

J. L. Jellison , J. Golden , D. R. Frear , F. M. Hosking , D. M. Keicher , F. G. Yost

ABSTRACT

Although solder technology’s roots are buried in antiquity, solder processing innovations are occurring at a faster pace than at any time in history. There are three primary drivers for this: rapidly changing design requirements, increasingly stringent process and product reliability requirements, and environmental issues. Improving solder processes to meet the needs of electronic manufacturing, while addressing a heightened awareness of environmental issues, including compliance to governmental regulations, is a great challenge to technologists supporting solder processes and will require the best efforts of multidisciplinary teams. More... »

PAGES

227-266

References to SciGraph publications

Book

TITLE

The Mechanics of Solder Alloy Wetting and Spreading

ISBN

978-1-4684-1442-4
978-1-4684-1440-0

Author Affiliations

Identifiers

URI

http://scigraph.springernature.com/pub.10.1007/978-1-4684-1440-0_8

DOI

http://dx.doi.org/10.1007/978-1-4684-1440-0_8

DIMENSIONS

https://app.dimensions.ai/details/publication/pub.1002880047


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