Electronic Packaging Applications View Full Text


Ontology type: schema:Chapter     


Chapter Info

DATE

2008

AUTHORS

Jeffrey C. Suhling , Pradeep Lall

ABSTRACT

Electronic packaging is a field in rapid evolution due to strong and competing customer demands for increased functionality and performance, further miniaturization, heightened reliability, and lower costs. Such product drivers cause a myriad of reliability challenges for the engineer involved in the mechanical design of electronic systems, and several methods of experimental mechanics have become critical tools for the design and development of electronic products. In this chapter, we present an overview of important experimental mechanics applications to electronic packaging. Mechanics and reliability issues for modern electronic systems are reviewed, and the challenges facing the experimentalist in the packaging field are discussed. Finally, we review the state of the art in measurement technology, with the presentation of selected key applications of experimental solid mechanics to the electronic packaging field. These important applications are grouped by the goal of the measurement being made, including delamination detection, silicon stress characterization, evaluation of solder joint deformations and strains, warpage measurements, evaluation of behavior under transient loading, and material characterization. For each application, the important experimental techniques are discussed and sample results are provided. More... »

PAGES

1015-1044

References to SciGraph publications

  • 2006. Techniques in Scanning Acoustic Microscopy for Enhanced Failure and Material Analysis of Microsystems in MEMS/NEMS
  • 1993. Die Stress Measurement Using Piezoresistive Stress Sensors in THERMAL STRESS AND STRAIN IN MICROELECTRONICS PACKAGING
  • 1993. Analysis of the Thermal Loading on Electronics Packages by Enhanced Moiré Interferometry in THERMAL STRESS AND STRAIN IN MICROELECTRONICS PACKAGING
  • 2007. Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods in MICRO- AND OPTO-ELECTRONIC MATERIALS AND STRUCTURES: PHYSICS, MECHANICS, DESIGN, RELIABILITY, PACKAGING
  • 2007. Advances in Optoelectronic Methodology for MOEMS Testing in MICRO- AND OPTO-ELECTRONIC MATERIALS AND STRUCTURES: PHYSICS, MECHANICS, DESIGN, RELIABILITY, PACKAGING
  • 1998-12. Recent advancements of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices in EXPERIMENTAL MECHANICS
  • 1994. High Sensitivity Moiré, Experimental Analysis for Mechanics and Materials in NONE
  • Book

    TITLE

    Springer Handbook of Experimental Solid Mechanics

    ISBN

    978-0-387-26883-5
    978-0-387-30877-7

    Author Affiliations

    Identifiers

    URI

    http://scigraph.springernature.com/pub.10.1007/978-0-387-30877-7_36

    DOI

    http://dx.doi.org/10.1007/978-0-387-30877-7_36

    DIMENSIONS

    https://app.dimensions.ai/details/publication/pub.1004397478


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