Darrel Frear


Ontology type: schema:Person     


Person Info

NAME

Darrel

SURNAME

Frear

Publications in SciGraph latest 50 shown

  • 2017 Packaging Materials in SPRINGER HANDBOOK OF ELECTRONIC AND PHOTONIC MATERIALS
  • 2009-12 Foreword in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-06 Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-02 Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-02 Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2006 Packaging Materials in SPRINGER HANDBOOK OF ELECTRONIC AND PHOTONIC MATERIALS
  • 2005-10 Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-11 Foreword in JOURNAL OF ELECTRONIC MATERIALS
  • 2001 Metallurgical Factors in AREA ARRAY INTERCONNECTION HANDBOOK
  • 1999-11 Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue in JOURNAL OF ELECTRONIC MATERIALS
  • 1999-05 Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 1996-05 The mechanical behavior of interconnect materials for electronic packaging in JOM
  • 1995-06 Materials, processing, and reliability issues for PWB assemblies in JOM
  • 1994-07 Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 1994-06 Optoelectronic interconnections and packaging: A materials challenge in JOM
  • 1993-07 Issues in the replacement of lead-bearing solders in JOM
  • 1993-02 Analysis of the reaction between 60Sn-40Pb solder with a Pd-Pt-Ag-Cu-Au alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 1993 Introduction: The Mechanics of Solder Alloy Wetting and Spreading in THE MECHANICS OF SOLDER ALLOY WETTING AND SPREADING
  • 1993 Advanced Soldering Processes in THE MECHANICS OF SOLDER ALLOY WETTING AND SPREADING
  • 1993 The Properties of Composite Solders in THE MECHANICS OF SOLDER ALLOY WETTING AND SPREADING
  • 1992-09 Metallurgical factors influencing the corrosion of aluminum, Al-Cu, and Al-Si alloy thin films in dilute hydrofluoric solution in METALLURGICAL TRANSACTIONS A
  • 1992-07 Materials issues in the multichip module packaging of electronics in JOM
  • 1990-09 Materials and mechanics issues of solder alloy applications in JOM
  • 1990-09 The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation in METALLURGICAL TRANSACTIONS A
  • 1989-11 Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints in JOURNAL OF ELECTRONIC MATERIALS
  • 1989-08 The microstructural details of β-Sn precipitation in a 5Sn-95Pb solder alloy in METALLURGICAL TRANSACTIONS A
  • 1989-07 Structure and properties of Al-1%Si thin films on Si as a function of gas impurities during DC magnetron-sputtered deposition in JOURNAL OF ELECTRONIC MATERIALS
  • 1988-06 Thermal Fatigue in Solder Joints in JOM
  • 1988-03 A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints in JOURNAL OF ELECTRONIC MATERIALS
  • 1987-05 The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder in JOURNAL OF ELECTRONIC MATERIALS
  • 1987-05 Tensile behavior of pb-sn solder/cu joints in JOURNAL OF ELECTRONIC MATERIALS
  • 1986-11 The formation of Cu3Sn intermetallic on the reaction of cu with 95Pb-5Sn solder in JOURNAL OF ELECTRONIC MATERIALS
  • 1986-02 A study of the effect of precipitated austenite on the fracture of a ferritic cryogenic steel in METALLURGICAL TRANSACTIONS A
  • Affiliations

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