Zhi Dong Xia


Ontology type: schema:Person     


Person Info

NAME

Zhi Dong

SURNAME

Xia

Publications in SciGraph latest 50 shown

  • 2019-04-22 Potential temperature sensing of oriented carbon-fiber filled composite and its resistance memory effect in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2017-06-07 Effect of Powder Morphologies on the Property of Conductive Silicone Rubber Filled with Carbonyl Nickel Powder in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-10-31 Electric anisotropy of carbon fiber-filled conductive composite vulcanized in electric field in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2013-08-01 Corrosion Behavior of Different Steel Substrates Coupled With Conductive Polymer Under Different Serving Conditions in JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL
  • 2011-01-19 Effects of electromigration on resistance changes in eutectic SnBi solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2010-05-15 Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2010-03-13 Investigation of the fracture morphologies of Sn3.8Ag0.7Cu joints under high-velocity conditions in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-11-13 Investigation of rare earth-doped BiAg high-temperature solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-09-27 Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-09-16 Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-07-31 Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2009-07-07 Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-06-13 Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2009-06-10 Lead-free solders with rare earth additions in JOM
  • 2009-05-22 Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-05-22 Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-04-28 Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-09-17 Study on the Microstructure and Wettability of an Al-Cu-Si Braze Containing Small Amounts of Rare Earth Erbium in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2008-09-10 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-09-06 Study on Al-Cu-Si braze containing small amount of rare earth erbium in FRONTIERS OF MATERIALS SCIENCE
  • 2008-08-20 In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-07-08 Recycling cobalt from spent lithium ion battery in FRONTIERS OF MATERIALS SCIENCE
  • 2008-07-03 Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-06-28 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04-23 Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04-18 Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-03-24 Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-10-26 Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-10-20 Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-09-12 Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-06-09 Creep property of composite solders reinforced by nano-sized particles in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2006-05 Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-11 Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-03 Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-09 Constitutive relations on creep for SnAgCuRE lead-free solder joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-04 Properties of lead-free solder SnAgCu containing minute amounts of rare earth in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-06 Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-02-01 Evaluation on the characteristics of tin-silver-bismuth solder in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
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