Fan Guo


Ontology type: schema:Person     


Person Info

NAME

Fan

SURNAME

Guo

Publications in SciGraph latest 50 shown

  • 2020-09-02 Mechanical Properties and Growth Mechanism of TiB2-TiC/Fe Composite Coating Fabricated in Situ by Laser Cladding in APPLIED COMPOSITE MATERIALS
  • 2020-04-17 Electromigration Behavior of Low-Silver Sn-0.3Ag-0.7Cu-1.6Bi-0.2In Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2020-02-19 Effect of grain boundary on failure behavior of SABI333 solder joints during creep in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2020-01-02 Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration in JOURNAL OF ELECTRONIC MATERIALS
  • 2019-10-16 The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields in JOURNAL OF ELECTRONIC MATERIALS
  • 2019-02-19 Effects of twin boundaries on the void formation in Cu-filled through silicon vias under thermal process in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2019-01-31 The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing in JOURNAL OF ELECTRONIC MATERIALS
  • 2018-11-21 Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment in JOURNAL OF ELECTRONIC MATERIALS
  • 2018-06-19 IMC growth behavior along c-axis of Sn grain under current stressing in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-05-31 Dependence of grain orientation in SABI333 solder joints on solidification temperature in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-04-26 Analysis of continuous recrystallization (sub)grain rotation behavior in Pb-free solder bumps under a 0.1 µm/s shear rate in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-03-14 Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock in JOURNAL OF ELECTRONIC MATERIALS
  • 2018-02-23 Effects of impurities on double twinning nucleation and grain refinement of Sn-based solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-02-15 A method to determine the slip systems in BGA lead-free solder joints during thermal fatigue in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-01-18 Recrystallized grain rotation behavior in a Pb-free BGA solder joint under electron current stress in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-01-16 Effects of Sn grain c-axis on electromigration in Cu reinforced composite solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-01-02 Nucleation and electromigration-induced grain rotation in an SABI333 solder joint in JOURNAL OF MATERIALS SCIENCE
  • 2017-12-29 Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-12-19 Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-12-06 Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-11-03 Effects of Grain Orientation on Cu6Sn5 Growth Behavior in Cu6Sn5-Reinforced Composite Solder Joints During Electromigration in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-10-31 Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-10-23 Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-09-06 Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-05-22 Effects of Grain Orientation on the Electromigration of Cu-Reinforced Composite Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-05-18 Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2017-01-11 Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2016-11-01 Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-09-15 Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-05-25 Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2016-04-15 Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration in JOURNAL OF MATERIALS RESEARCH
  • 2015-09-18 Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-11-11 Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint in JOURNAL OF MATERIALS RESEARCH
  • 2014-09-25 Improvement of Thermoelectric Properties Via Combination of Nanostructurization and Elemental Doping in JOM
  • 2014-08-14 Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-01-25 Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-08-01 Corrosion Behavior of Different Steel Substrates Coupled With Conductive Polymer Under Different Serving Conditions in JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL
  • 2013-07-17 Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-02-24 Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2012-11-28 The coupling effects of thermal cycling and high current density on Sn58Bi solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2012-11-13 Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches in JOURNAL OF ELECTRONIC MATERIALS
  • 2012-08-15 Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint in ELECTRONIC MATERIALS LETTERS
  • 2011-12-29 Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique in JOURNAL OF ELECTRONIC MATERIALS
  • 2011-12-02 A Model for Rapid Tin Whisker Growth on the Surface of ErSn3 Phase in JOURNAL OF ELECTRONIC MATERIALS
  • 2011-06-07 Enhanced electrical conductivity in Si80Ge20B0.6 alloys with Er addition prepared by spark plasma sintering in JOURNAL OF MATERIALS RESEARCH
  • 2011-02-25 Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2011-02-24 Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint in JOURNAL OF MATERIALS SCIENCE
  • 2011-01-19 Effects of electromigration on resistance changes in eutectic SnBi solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2010-11-04 Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-09-24 Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane in JOURNAL OF ELECTRONIC MATERIALS
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