Xiao-Yan Li


Ontology type: schema:Person     


Person Info

NAME

Xiao-Yan

SURNAME

Li

Publications in SciGraph latest 50 shown

  • 2021-03-08 Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy in METALLURGICAL AND MATERIALS TRANSACTIONS B
  • 2020-01-08 Investigation on shear fracture of different strain rates for Cu/Cu3Sn/Cu solder joints derived from Cu–15μm Sn–Cu sandwich structure in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-09 Improved Post-Weld Heat Treatment for Argon TIG Welded Joint of a New Al – Zn – Mg – Cu Alloy in METAL SCIENCE AND HEAT TREATMENT
  • 2016-11-19 Correlation Between Microstructure and Mechanical Properties of 2219-T8 Aluminum Alloy Joints by VPTIG Welding in ACTA METALLURGICA SINICA (ENGLISH LETTERS)
  • 2016-03-23 Softening Behavior of a New Al-Zn-Mg-Cu Alloy Due to TIG Welding in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2015-02-05 Stress relaxation behavior of lead-free solder joint in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-01-07 Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-10-18 Creep failure mechanism and life prediction of lead-free solder joint in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-06-19 Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-02-02 Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2013-09-28 Fracture assessment for electron beam welded damage tolerant Ti-6Al-4V alloy by the FITNET procedure in CHINESE JOURNAL OF MECHANICAL ENGINEERING
  • 2013-02-24 Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2013-01-04 Correlation Between Tensile Strength and Hardness of Electron Beam Welded TC4-DT Joints in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2012-05-08 Development of a Binary Zn-Based Solder Alloy for Joining Wrought Magnesium Alloy AZ31B in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2012-04-28 Limit load solution for electron beam welded joints with single edge weld center crack in tension in CHINESE JOURNAL OF MECHANICAL ENGINEERING
  • 2011-01-19 Effects of electromigration on resistance changes in eutectic SnBi solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2010-11-04 Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-05-28 Characterization of High-Frequency Induction Brazed Magnesium Alloy Joint with an Al-Mg-Zn Filler Metal in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2010 Typical Joint Defects in Laser Welding of Aluminium-Lithium Alloy in PROCEEDINGS OF THE 36TH INTERNATIONAL MATADOR CONFERENCE
  • 2009-11-13 Investigation of rare earth-doped BiAg high-temperature solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-09-16 Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-07-31 Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2009-07-07 Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-06-10 Lead-free solders with rare earth additions in JOM
  • 2009-05-22 Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-04-28 Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-11-18 Microstructure and Wear Performance of Arc Sprayed Fe-FeB-WC Coatings in JOURNAL OF THERMAL SPRAY TECHNOLOGY
  • 2008-09-17 Study on the Microstructure and Wettability of an Al-Cu-Si Braze Containing Small Amounts of Rare Earth Erbium in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2008-09-10 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-09-06 Study on Al-Cu-Si braze containing small amount of rare earth erbium in FRONTIERS OF MATERIALS SCIENCE
  • 2008-07-03 Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-06-28 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-03-24 Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-10-26 Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-06-09 Creep property of composite solders reinforced by nano-sized particles in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2007-05-01 Effect of laser beam welding on fracture toughness of a Ti-6.5Al-2Zr-1Mo-1V alloy sheet in JOURNAL OF MATERIALS SCIENCE
  • 2005-10 Three-dimensional finite element analysis of critical pre-twist strain angle for torsional axis in JOURNAL OF CENTRAL SOUTH UNIVERSITY
  • 2005-10 Analysis of corrosion failure of petrochemical pipe elbow in JOURNAL OF CENTRAL SOUTH UNIVERSITY
  • 2005-10 Failure analysis of wear of main clutch separating ring of heavy vehicles in JOURNAL OF CENTRAL SOUTH UNIVERSITY
  • Affiliations

    JSON-LD is the canonical representation for SciGraph data.

    TIP: You can open this SciGraph record using an external JSON-LD service: JSON-LD Playground Google SDTT

    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "affiliation": [
          {
            "affiliation": {
              "id": "http://www.grid.ac/institutes/grid.28703.3e", 
              "type": "Organization"
            }, 
            "isCurrent": true, 
            "type": "OrganizationRole"
          }
        ], 
        "familyName": "Li", 
        "givenName": "Xiao-Yan", 
        "id": "sg:person.014361463331.82", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.014361463331.82"
        ], 
        "sdDataset": "persons", 
        "sdDatePublished": "2022-01-01T19:58", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-springernature-scigraph/baseset/20220101/entities/gbq_results/person/person_922.jsonl", 
        "type": "Person"
      }
    ]
     

    Download the RDF metadata as:  json-ld nt turtle xml License info

    HOW TO GET THIS DATA PROGRAMMATICALLY:

    JSON-LD is a popular format for linked data which is fully compatible with JSON.

    curl -H 'Accept: application/ld+json' 'https://scigraph.springernature.com/person.014361463331.82'

    N-Triples is a line-based linked data format ideal for batch operations.

    curl -H 'Accept: application/n-triples' 'https://scigraph.springernature.com/person.014361463331.82'

    Turtle is a human-readable linked data format.

    curl -H 'Accept: text/turtle' 'https://scigraph.springernature.com/person.014361463331.82'

    RDF/XML is a standard XML format for linked data.

    curl -H 'Accept: application/rdf+xml' 'https://scigraph.springernature.com/person.014361463331.82'


     




    Preview window. Press ESC to close (or click here)


    ...