Yongping Lei


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Person Info

NAME

Yongping

SURNAME

Lei

Publications in SciGraph latest 50 shown

  • 2018-10 Microstructure and mechanical properties of in situ (Ti, Nb)Cp/Fe-based laser composite coating prepared with different heat inputs in RARE METALS
  • 2018-04 Effects of TiB2 Particle and Short Fiber Sizes on the Microstructure and Properties of TiB2-Reinforced Composite Coatings in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2018-03 Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-11 Effect of Powder Morphologies on the Property of Conductive Silicone Rubber Filled with Carbonyl Nickel Powder in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-02 The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-11 Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-02 Phase Diagram Calculation and Analyze on Cast High-Boron High-Speed Steel in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2016-02 Distribution Characteristics and Reinforcing Behavior of (Ti, Nb)C Reinforced Particle in the Coating Fabricated by Laser Rapid Cladding in JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL
  • 2016-01 A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact in JOURNAL OF ELECTRONIC MATERIALS
  • 2015-10 Microstructure and Properties of (TiB2 + NiTi)/Ti Composite Coating Fabricated by Laser Cladding in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2015-10 Microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-04 Microstructure and Solderability of Zn-6Al-xSn Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-09 Fracture assessment for electron beam welded damage tolerant Ti-6Al-4V alloy by the FITNET procedure in CHINESE JOURNAL OF MECHANICAL ENGINEERING
  • 2013-06 Correlation Between Tensile Strength and Hardness of Electron Beam Welded TC4-DT Joints in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2013-04 Microstructure and Properties of Cast B-Bearing High Speed Steel in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2012-05 Limit load solution for electron beam welded joints with single edge weld center crack in tension in CHINESE JOURNAL OF MECHANICAL ENGINEERING
  • 2011-12 A Study on the Wear Behavior of Cast Boron Steel in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2011-05 Effects of electromigration on resistance changes in eutectic SnBi solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2011-03 Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2010-09 Investigation of rare earth-doped BiAg high-temperature solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2010-08 Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-07 Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2010-03 Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-12 Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-11 Effect of TiC Particle Additions on Structure and Properties of Hypereutectic High Chromium Cast Iron in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2009-10 Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-09 Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-09 Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-08 Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2009-06 Lead-free solders with rare earth additions in JOM
  • 2009-06 Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-06 Effect of homogenization temperature on microstructure and mechanical properties of low-carbon high-boron cast steel in METALS AND MATERIALS INTERNATIONAL
  • 2009-04 Study on the Microstructure and Wettability of an Al-Cu-Si Braze Containing Small Amounts of Rare Earth Erbium in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
  • 2009-02 Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-12 Study on Al-Cu-Si braze containing small amount of rare earth erbium in FRONTIERS OF MATERIALS SCIENCE IN CHINA
  • 2008-11 In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-11 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-10 Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-09 Recycling cobalt from spent lithium ion battery in FRONTIERS OF MATERIALS SCIENCE IN CHINA
  • 2008-07 Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04 Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-04 Creep property of composite solders reinforced by nano-sized particles in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-03 Reduction of residual stress and deformation in electron beam welding by using multiple beam technique in FRONTIERS OF MATERIALS SCIENCE IN CHINA
  • 2008-01 Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-01 Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-06 The study of surface-active element oxygen on flow patterns and penetration in A-TIG welding in METALLURGICAL AND MATERIALS TRANSACTIONS B
  • 2006-05 Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-03 Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint in JOURNAL OF ELECTRONIC MATERIALS
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    [
      {
        "@context": "https://springernature.github.io/scigraph/jsonld/sgcontext.json", 
        "familyName": "Lei", 
        "givenName": "Yongping", 
        "id": "sg:person.012521025203.12", 
        "sameAs": [
          "https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12"
        ], 
        "sdDataset": "persons", 
        "sdDatePublished": "2019-03-07T14:07", 
        "sdLicense": "https://scigraph.springernature.com/explorer/license/", 
        "sdPublisher": {
          "name": "Springer Nature - SN SciGraph project", 
          "type": "Organization"
        }, 
        "sdSource": "s3://com-uberresearch-data-dimensions-researchers-20181010/20181011/dim_researchers/base/researchers_1881.json", 
        "type": "Person"
      }
    ]
     

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    This table displays all metadata directly associated to this object as RDF triples.

    11 TRIPLES      9 PREDICATES      10 URIs      6 LITERALS      1 BLANK NODES

    Subject Predicate Object
    1 sg:person.012521025203.12 schema:familyName Lei
    2 schema:givenName Yongping
    3 schema:sameAs https://app.dimensions.ai/discover/publication?and_facet_researcher=ur.012521025203.12
    4 schema:sdDatePublished 2019-03-07T14:07
    5 schema:sdLicense https://scigraph.springernature.com/explorer/license/
    6 schema:sdPublisher Na6aa951be1c84edca9ed29c6a43dbf99
    7 sgo:license sg:explorer/license/
    8 sgo:sdDataset persons
    9 rdf:type schema:Person
    10 Na6aa951be1c84edca9ed29c6a43dbf99 schema:name Springer Nature - SN SciGraph project
    11 rdf:type schema:Organization
     




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