Keun Soo Kim


Ontology type: schema:Person     


Person Info

NAME

Keun Soo

SURNAME

Kim

Publications in SciGraph latest 50 shown

  • 2015-10 Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films in JOURNAL OF ELECTRONIC MATERIALS
  • 2014-05 An alginate-like exopolysaccharide biosynthesis gene cluster involved in biofilm aerial structure formation by Pseudomonas alkylphenolia in APPLIED MICROBIOLOGY AND BIOTECHNOLOGY
  • 2014-01 Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-12 Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2013-08 Least lead addition to mitigate tin whisker for ambient storage in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2012-02 A novel high-speed shear test for lead-free flip chip packages in ELECTRONIC MATERIALS LETTERS
  • 2011-11 Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes in JOURNAL OF ELECTRONIC MATERIALS
  • 2011-11 Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2011-02 Electrical Resistance and Microstructural Changes of Silver–Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-12 Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-10 Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2010-07 Synthesis of silver nanorods and application for die attach material in devices in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2009-12 Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-06 Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-06 Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-02 Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-01 High-temperature lead-free solders: Properties and possibilities in JOM
  • 2007-12 Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-01 Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-06 The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging in JOM
  • 2003-12 In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-11 Interfaces in lead-free soldering in JOURNAL OF ELECTRONIC MATERIALS
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