Y C Chan


Ontology type: schema:Person     


Person Info

NAME

Y C

SURNAME

Chan

Publications in SciGraph latest 50 shown

  • 2018-12 Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction in JOURNAL OF ELECTRONIC MATERIALS
  • 2018-05 Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2018-04 Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2017-06 Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM) in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2016-11 Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles in JOURNAL OF MATERIALS SCIENCE
  • 2016-09 An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2016-07 Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-11 Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-09 Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-07 The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2015-07 Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-12 Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-10 A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-09 Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-06 Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-06 Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-05 Effect of 1 wt% ZnO nanoparticles addition on the microstructure, IMC development, and mechanical properties of high Bi content Sn–57.6Bi–0.4Ag solder on Ni metalized Cu pads in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2014-03 Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2013-09 Effect of Trace Diamond Nanoparticle Addition on the Interfacial, Mechanical, and Damping Properties of Sn-3.0Ag-0.5Cu Solder Alloy in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-07 Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn–58Bi solder joint in MICROSYSTEM TECHNOLOGIES
  • 2012-07 Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2011-03 Thermomigration and electromigration in Sn8Zn3Bi solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2010-10 Thermomigration and electromigration in Sn58Bi ball grid array solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2008-11 Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-09 Effect of current stressing on the reliability of 63Sn37Pb solder joints in JOURNAL OF MATERIALS SCIENCE
  • 2007-08 The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature in JOURNAL OF MATERIALS SCIENCE
  • 2007-07 Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization in JOURNAL OF MATERIALS SCIENCE
  • 2006-11 Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2006-10 Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-04 Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2006-03 Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications in JOURNAL OF ELECTRONIC MATERIALS
  • 2006-01 Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-08 Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-08 Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-03 Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2005-02 Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging in JOURNAL OF ELECTRONIC MATERIALS
  • 2005-01 Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-09 Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-03 Effect of spin coating on the curing rate of epoxy adhesive for the fabrication of a polymer optical waveguide in JOURNAL OF ELECTRONIC MATERIALS
  • 2004-01 A continuous contact resistance monitoring during the temperature ramp of anisotropic conductive adhesive film joint in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-10 Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-04 Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-03 Curing kinetics of anisotropic conductive adhesive film in JOURNAL OF ELECTRONIC MATERIALS
  • 2003-02 Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications in JOURNAL OF ELECTRONIC MATERIALS
  • 2002-10 Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow in JOURNAL OF ELECTRONIC MATERIALS
  • 2000-11 Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2000-10 Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization in JOURNAL OF MATERIALS SCIENCE LETTERS
  • 2000-08 Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging in JOURNAL OF ELECTRONIC MATERIALS
  • 2000-08 Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying in JOURNAL OF ELECTRONIC MATERIALS
  • 1999-12 Optical characterization of hydrogenated amorphous silicon thin films deposited at high rate in JOURNAL OF ELECTRONIC MATERIALS
  • Affiliations

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