Knut E Aasmundtveit

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Person Info


Knut E



Publications in SciGraph latest 50 shown

  • 2015-11 High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2015-09 Miniaturization of package for an implantable heart monitoring device in MICROSYSTEM TECHNOLOGIES
  • 2015-06 Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2015 Direct Integration of Carbon Nanotubes in Si Microsystems in NANOPACKAGING: FROM NANOMATERIALS TO THE ATOMIC SCALE
  • 2013-12 Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization in JOURNAL OF ELECTRONIC MATERIALS
  • 2013-09 Local synthesis of carbon nanotubes for direct integration in Si microsystems – design considerations in ADVANCES IN MANUFACTURING
  • 2013-07 Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2013-04 Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology in METALLURGICAL AND MATERIALS TRANSACTIONS B
  • 2012-09 Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding in JOURNAL OF ELECTRONIC MATERIALS
  • 2012-04 Au-Sn SLID Bonding—Properties and Possibilities in METALLURGICAL AND MATERIALS TRANSACTIONS B
  • 2010-01-23 High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications in ADVANCED MATERIALS AND TECHNOLOGIES FOR MICRO/NANO-DEVICES, SENSORS AND ACTUATORS
  • 2007-12 Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction in BIOMEDICAL MICRODEVICES
  • Affiliations

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