C M Gourlay


Ontology type: schema:Person     


Person Info

NAME

C M

SURNAME

Gourlay

Publications in SciGraph latest 50 shown

  • 2019-01 Advances in Electronic Interconnection Materials in JOM
  • 2019-01 Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • 2019-01 Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder in JOURNAL OF ELECTRONIC MATERIALS
  • 2018-01-28 The Morphology and Distribution of Al8Mn5 in High Pressure Die Cast AM50 and AZ91 in MAGNESIUM TECHNOLOGY 2018
  • 2018-01 The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2017-12 Reply to ‘Comments on “Evidence of the hydrogen release mechanism in bulk MgH2”’ in SCIENTIFIC REPORTS
  • 2017-12 In situ imaging of microstructure formation in electronic interconnections in SCIENTIFIC REPORTS
  • 2017-12 Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections in NATURE COMMUNICATIONS
  • 2017 Growth of Al8Mn5 Intermetallic in AZ91 in MAGNESIUM TECHNOLOGY 2017
  • 2017 Real-Time Observation of AZ91 Solidification by Synchrotron Radiography in MAGNESIUM TECHNOLOGY 2017
  • 2016-01 Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-01 The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints in JOURNAL OF ELECTRONIC MATERIALS
  • 2016-01 Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process in JOURNAL OF ELECTRONIC MATERIALS
  • 2015-10 Nucleation and Growth of Tin in Pb-Free Solder Joints in JOM
  • 2015-07 Evidence of the hydrogen release mechanism in bulk MgH2 in SCIENTIFIC REPORTS
  • 2014-12 Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography in NATURE COMMUNICATIONS
  • 2014-11 In Situ Observation of Deformation in Semi-solid Fe-C Alloys at High Shear Rate in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2014-09 Eutectic Morphology of Al-7Si-0.3Mg Alloys with Scandium Additions in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2014-08 Synchrotron Radiography Studies of Shear-Induced Dilation in Semisolid Al Alloys and Steels in JOM
  • 2014-02 Solidification of Sn-0.7Cu-0.15Zn Solder: In Situ Observation in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2012-12 NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples in JOURNAL OF ELECTRONIC MATERIALS
  • 2010-07 Feeding Mechanisms in High-Pressure Die Castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2010-01 Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2009-10 Microstructure formation in high pressure die casting in TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS
  • 2009-07 Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2009-06 Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates in JOM
  • 2008-01 The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys in JOURNAL OF ELECTRONIC MATERIALS
  • 2008-01 The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi in JOURNAL OF ELECTRONIC MATERIALS
  • 2007-08 Defect Band Characteristics in Mg-Al and Al-Si High-Pressure Die Castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2007-01 Dilatant shear bands in solidifying metals in NATURE
  • 2005-03 Migration of crystals during the filling of semi-solid castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2005-03 Migration of crystals during the filling of semi-solid castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
  • 2004-09 Segregation band formation in Al-Si die castings in METALLURGICAL AND MATERIALS TRANSACTIONS A
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