N/A
AUTHORSAnna Lee Tonkovich , Kai Tod Paul Jarosch , Jeffrey D. Marco , Bin Yang , Sean Patrick Fitzgerald , Steven T. Perry , Thomas Yuschak , Francis P. Daly , Haibiao Chen
ABSTRACTThe disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall. More... »
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