Methods of rejuvenating sputtering targets


Ontology type: sgo:Patent     


Patent Info

DATE

N/A

AUTHORS

Steven A. Miller , Prabhat Kumar , Rong-Chein Richard Wu , Shuwei Sun , Stefan Zimmermann , Olaf Schmidt-Park

ABSTRACT

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material. More... »

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