Preparation of ultra-shallow semiconductor junctions using intermediate temperature ramp rates and solid interfaces for defect engineering


Ontology type: sgo:Patent     


Patent Info

DATE

N/A

AUTHORS

Edmund G. Seebauer

ABSTRACT

Described herein are processing conditions, techniques, and methods for preparation of ultra-shallow semiconductor junctions. Methods described herein utilize semiconductor surface processing or modification to limit the extent of dopant diffusion under annealing conditions (e.g. temperature ramp rates between 100 and 5000° C./second) previously thought impractical for the preparation of ultra-shallow semiconductor junctions. Also described herein are techniques for preparation of ultra-shallow semiconductor junctions utilizing the presence of a solid interface for control of dopant diffusion and activation. More... »

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