Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires


Ontology type: sgo:Patent     


Patent Info

DATE

2007-10-09T00:00

AUTHORS

Ephraim Suhir

ABSTRACT

The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed, as well as a test device for identifying the accurate contact pressure required in same. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed. More... »

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